J. Phys. Chem. C, 112 (11), 4097 -4103, 2008. 10.1021/jp077371n S1932-7447(07)07371-2
Web Release Date: February 22, 2008

Copyright © 2008 American Chemical Society

Mechanical and Thermal Properties of Metallic and Semiconductive Nanostructures

G. Guisbiers,* M. Kazan, O. Van Overschelde, M. Wautelet, and S. Pereira

CICECO, University of Aveiro, 3810-193 Aveiro, Portugal, and Physics of Condensed Matter, University of Mons-Hainaut, Avenue Maistriau 23, 7000 Mons, Belgium

Received: September 13, 2007

In Final Form: November 28, 2007

Abstract:

Using a top-down approach, we report a theoretical investigation of the melting temperature at the nanoscale, Tm, for different shapes of "free-standing" nanostructures. To easily calculate the nanoscale melting temperature for a wide range of metals and semiconductors, a convenient shape parameter called shape is defined. Considering this parameter, we argue why smaller size effects are observed in high bulk melting temperature materials. Using Tm, a phase transition stress model is proposed to evaluate the intrinsic strain and stress during the first steps of solidification. Then, the size effect on the Thornton & Hoffman's criterion at the nanoscale is discussed and the intrinsic residual stress determination in nanostructures is found to be essential for sizes below 100 nm. Furthermore, the inverse Hall-Petch effect, for sizes below ~15 nm, can be understood by this model. Finally, the residual strain in hexagonal zinc oxide nanowires is calculated as a function of the wire dimensions.


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