Chemical Etching of Group III - V Semiconductors

Najah J. Kadhim , Stuart H. Laurie and D. Mukherjee
South Bank University, School of Electrical, Electronic and Information Engineering, Borough Road, London SE1 0AA, UNITED KINGDOM
J. Chem. Educ., 1998, 75 (7), p 840
DOI: 10.1021/ed075p840
Publication Date (Web): July 1, 1998

Abstract

Chemical etching is basically a process used to selectively remove controlled amounts of material from the original substrate. The etch depth can be designed to be just tens of angstroms or up to a few hundred angstroms.

The etching process is one of the important stages in the fabrication of micro electronics devices. Errors at this stage will severely impair performance of these devices.

Due to the present diadvantages of dry etching, wet chemical etching will still be useful for some time. it is infact one of the standard technique for the processing of Integral Circuits (Ics).

This article reviews the chemical etchants used for the reatment of GaAs and others III - V. Semiconductors, the factors involved in their mechanism and the many potential pitfalls, arwillan detects associated with them.

The article should present an understandable account for the non-specialist reaser yet it does offer a useful material and information for the specialists readers an well.

Tools

SciFinder Links

SciFinder subscribers:  Click to sign in | Not a SciFinder subscriber? Learn more at www.cas.org

Explore by:


History

  • Received: August 03, 2009

Recommend & Share

Related Content