Two-Dimensional Materials Inserted at the Metal/Semiconductor Interface: Attractive Candidates for Semiconductor Device ContactsClick to copy article linkArticle link copied!
- Min-Hyun LeeMin-Hyun LeeSamsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Min-Hyun Lee
- Yeonchoo ChoYeonchoo ChoSamsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Yeonchoo Cho
- Kyung-Eun ByunKyung-Eun ByunSamsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Kyung-Eun Byun
- Keun Wook ShinKeun Wook ShinSamsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Keun Wook Shin
- Seong-Geol NamSeong-Geol NamSamsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Seong-Geol Nam
- Changhyun KimChanghyun KimSamsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Changhyun Kim
- Haeryong KimHaeryong KimSamsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Haeryong Kim
- Sang-A HanSang-A HanSchool of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), 2066 Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of KoreaMore by Sang-A Han
- Sang-Woo KimSang-Woo KimSchool of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), 2066 Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of KoreaMore by Sang-Woo Kim
- Hyeon-Jin Shin*Hyeon-Jin Shin*E-mail: [email protected]Samsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Hyeon-Jin Shin
- Seongjun ParkSeongjun ParkSamsung Advanced Institute of Technology, Suwon 443-803, Republic of KoreaMore by Seongjun Park
Abstract

Metal–semiconductor junctions are indispensable in semiconductor devices, but they have recently become a major limiting factor precluding device performance improvement. Here, we report the modification of a metal/n-type Si Schottky contact barrier by the introduction of two-dimensional (2D) materials of either graphene or hexagonal boron nitride (h-BN) at the interface. We realized the lowest specific contact resistivities (ρc) of 3.30 nΩ cm2 (lightly doped n-type Si, ∼ 1015/cm3) and 1.47 nΩ cm2 (heavily doped n-type Si, ∼ 1021/cm3) via 2D material insertion are approaching the theoretical limit of 1.3 nΩ cm2. We demonstrated the role of the 2D materials at the interface in achieving a low ρc value by the following mechanisms: (a) 2D materials effectively form dipoles at the metal–2D material (M/2D) interface, thereby reducing the metal work function and changing the pinning point, and (b) the fully metalized M/2D system shifts the pinning point toward the Si conduction band, thus decreasing the Schottky barrier. As a result, the fully metalized M/2D system using atomically thin and well-defined 2D materials shows a significantly reduced ρc. The proposed 2D material insertion technique can be used to obtain extremely low contact resistivities in metal/n-type Si systems and will help to achieve major performance improvements in semiconductor technologies.
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