Flexible Bottom-Gated Organic Field-Effect Transistors Utilizing Stamped Polymer Layers from the Surface of WaterClick to copy article linkArticle link copied!
- Yoori SungYoori SungSchool of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of KoreaMore by Yoori Sung
- Eul-Yong ShinEul-Yong ShinPhoto-Electronic Hybrids Research Center, Korea Institute of Science and Technology (KIST), Seoul 02792, Republic of KoreaMore by Eul-Yong Shin
- Yong-Young Noh*Yong-Young Noh*Email: [email protected]Department of Chemical Engineering, Pohang University of Science and Technology (POSTECH), 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Republic of KoreaMore by Yong-Young Noh
- Jung-Yong Lee*Jung-Yong Lee*Email: [email protected]School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of KoreaMore by Jung-Yong Lee
Abstract

The facile sequential deposition of functional organic thin films by solution processes is critical for the development of a variety of high-performance organic devices without restriction in terms of materials and processes. Herein, we propose a simple fabrication process that entails stacking multiple layers of functional polymers to fabricate organic field-effect transistors (OFETs). The process involves stamping organic semiconducting layers formed on the surface of water onto a commonly used polymeric dielectric layer. Our scheme makes it possible to independently optimize organic semiconductor films by controlling the solvent evaporation time during the process of film formation on the surface of water. This approach eliminates the need to be concerned about any interference with adjacent layers. Utilizing this process, the fabrication of high-performance bottom-gated OFETs is demonstrated on a glass and a flexible substrate. The OFETs consist of a vertically stacked diketopyrrolopyrrole-based polymer semiconducting layer on the poly(methyl methacrylate) film with a maximum hole mobility of 0.85 cm2/V s.
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