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Carrier Mobility Modulation in Cu2Se Composites Using Coherent Cu4TiSe4 Inclusions Leads to Enhanced Thermoelectric Performance
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    Carrier Mobility Modulation in Cu2Se Composites Using Coherent Cu4TiSe4 Inclusions Leads to Enhanced Thermoelectric Performance
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    • Yixuan Chen
      Yixuan Chen
      Laboratory for Emerging Energy and Electronic Materials (LE3M), Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan48109, United States
      Department of Chemical Engineering, University of Michigan, Ann Arbor, Michigan48109, United States
      More by Yixuan Chen
    • Yinying Zhang
      Yinying Zhang
      Department of Physics, University of Michigan, Ann Arbor, Michigan48109, United States
    • Ctirad Uher
      Ctirad Uher
      Department of Physics, University of Michigan, Ann Arbor, Michigan48109, United States
      More by Ctirad Uher
    • Pierre F. P. Poudeu*
      Pierre F. P. Poudeu
      Laboratory for Emerging Energy and Electronic Materials (LE3M), Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan48109, United States
      Department of Chemical Engineering, University of Michigan, Ann Arbor, Michigan48109, United States
      *Email: [email protected]. Fax: +1-734-763-4788.
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    ACS Applied Materials & Interfaces

    Cite this: ACS Appl. Mater. Interfaces 2022, 14, 51, 56817–56826
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    https://doi.org/10.1021/acsami.2c17146
    Published December 15, 2022
    Copyright © 2022 American Chemical Society

    Abstract

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    Carrier transport engineering in bulk semiconductors using inclusion phases often results in the deterioration of carrier mobility (μ) owing to enhanced carrier scattering at phase boundaries. Here, we show by leveraging the temperature-induced structural transition between the α-Cu2Se and β-Cu2Se polymorphs that the incorporation of Cu4TiSe4 inclusions within the Cu2Se matrix results in a gradual large drop in the carrier mobility at temperatures below 400 K (α-Cu2Se), whereas the carrier mobility remains unchanged at higher temperatures, where the β-Cu2Se polymorph dominates. The sharp discrepancy in the electronic transport within the α-Cu2Se and β-Cu2Se matrices is associated with the formation of incoherent α-Cu2Se/Cu4TiSe4 interfaces, owing to the difference in their atomic structures and lattice parameters, which results in enhanced carrier scattering. In contrast, the similarity of the Se sublattices between β-Cu2Se and Cu4TiSe4 gives rise to coherent phase boundaries and good band alignment, which promote carrier transport across the interfaces. Interestingly, the different cation arrangements in Cu4TiSe4 and β-Cu2Se contribute to enhanced phonon scattering at the interfaces, which leads to a reduction in the lattice thermal conductivity. The large reduction in the total thermal conductivity while preserving the high power factor of β-Cu2Se in the (1–x)Cu2Se/(x)Cu4TiSe4 composites results in an improved ZT of 1.2 at 850 K, with an average ZT of 0.84 (500–850 K) for the composite with x = 0.01. This work highlights the importance of structural similarity between the matrix and inclusions when designing thermoelectric materials with improved energy conversion efficiency.

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    Supporting Information

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    The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsami.2c17146.

    • XRD for all composites in the powder form; HAADF-STEM and EDS of the (0.99)Cu2Se/(0.01)Cu4TiSe4 composite; atomic concentrations of the (0.97)Cu2Se/(0.03)Cu4TiSe4 composite; temperature-dependent carrier mobility and relations between carrier concentration and mobility; change of the Seebeck coefficient and the carrier concentration with the Cu4TiSe4 content; temperature-dependent heat capacity and Lorenz number; and bulk densities for all composites (PDF)

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    Cited By

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    This article is cited by 1 publications.

    1. Ankit Kumar, Dinesh Kumar Kedia, Prasenjit Ghosh, Surjeet Singh. Band Engineering and Synergistic Modulation Doping for Excellent Thermoelectric Performance in Composites Ti1–xNbxCoSb–Nb0.8+δCoSb. ACS Applied Energy Materials 2023, 6 (20) , 10694-10703. https://doi.org/10.1021/acsaem.3c01888

    ACS Applied Materials & Interfaces

    Cite this: ACS Appl. Mater. Interfaces 2022, 14, 51, 56817–56826
    Click to copy citationCitation copied!
    https://doi.org/10.1021/acsami.2c17146
    Published December 15, 2022
    Copyright © 2022 American Chemical Society

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