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Download Hi-Res ImageDownload to MS-PowerPointCite This:ACS Appl. Mater. Interfaces 2019, 11, 20, 18739-18745
    Research Article

    Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics
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    • Chang-Ping Feng
      Chang-Ping Feng
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      More by Chang-Ping Feng
    • Li-Bo Chen
      Li-Bo Chen
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      More by Li-Bo Chen
    • Guo-Liang Tian
      Guo-Liang Tian
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      More by Guo-Liang Tian
    • Shen-Shen Wan
      Shen-Shen Wan
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      More by Shen-Shen Wan
    • Lu Bai
      Lu Bai
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      More by Lu Bai
    • Rui-Ying Bao
      Rui-Ying Bao
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      More by Rui-Ying Bao
      Orcidhttp://orcid.org/0000-0002-1373-7154
    • Zheng-Ying Liu
      Zheng-Ying Liu
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      More by Zheng-Ying Liu
    • Ming-Bo Yang
      Ming-Bo Yang
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      More by Ming-Bo Yang
      Orcidhttp://orcid.org/0000-0001-7950-7645
    • Wei Yang*
      Wei Yang
      College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, Sichuan, People’s Republic of China
      *E-mail: [email protected]. Tel.: + 86 28 8546 0130. Fax: + 86 28 8546 0130.
      More by Wei Yang
      Orcidhttp://orcid.org/0000-0003-0198-1632
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    ACS Applied Materials & Interfaces

    Cite this: ACS Appl. Mater. Interfaces 2019, 11, 20, 18739–18745
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    https://doi.org/10.1021/acsami.9b03885
    Published April 26, 2019
    Copyright © 2019 American Chemical Society
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    Abstract

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    Thermal management materials (TMMs) used in electronic devices are crucial for future electronics and technologies such as flexible electronics and artificial intelligence (AI) technologies. As future electronics will work in a more complicated circumstance, the overheating and overcooling problems can exist in the same electronics while the common TMMs cannot meet the demand of thermal management for future electronics. In this work, nacre-mimetic graphene-based films with super flexibility and durability (in over 10,000 tensile cycles), excellent capability to dissipate excess heat (20.84 W/(m·K) at only 16–22 μm thickness), and outstanding heating performance to generate urgent heat for electronics under extremely cold conditions are fabricated by a facile solution casting method, and the fabricated composites are proved to be superior multifunctional TMMs for the thermal management in electronic chips. In addition, the application of the paper-like films with high in-plane thermal conductivity to a flexible heat spreader and film heater is demonstrated by simulation using a finite volume method, which shows the high importance of the in-plane thermal conductivity in thermal management of electronics.

    Copyright © 2019 American Chemical Society

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    Supporting Information

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    The Supporting Information is available free of charge on the ACS Publications website at DOI: 10.1021/acsami.9b03885.

    • Morphology of GO and NR, SEM images of the NR/RGO composite films, typical stress–strain curves of NR/RGO composite films, thermal conductivity of composites before and after tensile recovery testing, optical images of the hand model equipped with an electronic chip for the demonstration of the thermal management capability of 38.53RGO samples as multifunctional TMMs, infrared images and temperature variation of NR/RGO composite films with different contents of RGO at different applied voltages, geometry and mesh used in the simulation, mathematical descriptions used in the simulation, major physical parameters used in the simulation, and typical convective heat transfer coefficients used in the simulation (PDF)

    • Heat dissipation (AVI)

    • Heat generation (AVI)

    • Change of the average temperature of the chip with different heat sources of TMMs (AVI)

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    Cited By

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    This article is cited by 130 publications.

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    Cite this: ACS Appl. Mater. Interfaces 2019, 11, 20, 18739–18745
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