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Technology Roadmap for Flexible Sensors
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Technology Roadmap for Flexible Sensors
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  • Yifei Luo
    Yifei Luo
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
    Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
    More by Yifei Luo
  • Mohammad Reza Abidian
    Mohammad Reza Abidian
    Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
  • Jong-Hyun Ahn
    Jong-Hyun Ahn
    School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
  • Deji Akinwande
    Deji Akinwande
    Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
    Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
  • Anne M. Andrews
    Anne M. Andrews
    Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Markus Antonietti
    Markus Antonietti
    Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
  • Zhenan Bao
    Zhenan Bao
    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
    More by Zhenan Bao
  • Magnus Berggren
    Magnus Berggren
    Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
    Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden
  • Christopher A. Berkey
    Christopher A. Berkey
    Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
  • Christopher John Bettinger
    Christopher John Bettinger
    Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
  • Jun Chen
    Jun Chen
    Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
    More by Jun Chen
  • Peng Chen
    Peng Chen
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
    More by Peng Chen
  • Wenlong Cheng
    Wenlong Cheng
    Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
    Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800
  • Xu Cheng
    Xu Cheng
    Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
    More by Xu Cheng
  • Seon-Jin Choi
    Seon-Jin Choi
    Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
  • Alex Chortos
    Alex Chortos
    School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
    More by Alex Chortos
  • Canan Dagdeviren
    Canan Dagdeviren
    Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
  • Reinhold H. Dauskardt
    Reinhold H. Dauskardt
    Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
  • Chong-an Di
    Chong-an Di
    Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
    More by Chong-an Di
  • Michael D. Dickey
    Michael D. Dickey
    Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
  • Xiangfeng Duan
    Xiangfeng Duan
    Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Antonio Facchetti
    Antonio Facchetti
    Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
  • Zhiyong Fan
    Zhiyong Fan
    Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
    More by Zhiyong Fan
  • Yin Fang
    Yin Fang
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
    More by Yin Fang
  • Jianyou Feng
    Jianyou Feng
    State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
    More by Jianyou Feng
  • Xue Feng
    Xue Feng
    Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
    More by Xue Feng
  • Huajian Gao
    Huajian Gao
    School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
    Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
    More by Huajian Gao
  • Wei Gao
    Wei Gao
    Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
    More by Wei Gao
  • Xiwen Gong
    Xiwen Gong
    Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
    More by Xiwen Gong
  • Chuan Fei Guo
    Chuan Fei Guo
    Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
  • Xiaojun Guo
    Xiaojun Guo
    National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
    More by Xiaojun Guo
  • Martin C. Hartel
    Martin C. Hartel
    Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Zihan He
    Zihan He
    Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
    More by Zihan He
  • John S. Ho
    John S. Ho
    Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
    The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
    More by John S. Ho
  • Youfan Hu
    Youfan Hu
    School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
    More by Youfan Hu
  • Qiyao Huang
    Qiyao Huang
    School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
    More by Qiyao Huang
  • Yu Huang
    Yu Huang
    Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
    More by Yu Huang
  • Fengwei Huo
    Fengwei Huo
    Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
    More by Fengwei Huo
  • Muhammad M. Hussain
    Muhammad M. Hussain
    mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
  • Ali Javey
    Ali Javey
    Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
    Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
    More by Ali Javey
  • Unyong Jeong
    Unyong Jeong
    Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
    More by Unyong Jeong
  • Chen Jiang
    Chen Jiang
    Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
    More by Chen Jiang
  • Xingyu Jiang
    Xingyu Jiang
    Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
    More by Xingyu Jiang
  • Jiheong Kang
    Jiheong Kang
    Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
    More by Jiheong Kang
  • Daniil Karnaushenko
    Daniil Karnaushenko
    Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
  • Ali Khademhosseini
    Ali Khademhosseini
    Terasaki Institute for Biomedical Innovation, Los Angeles, CA, USA
  • Dae-Hyeong Kim
    Dae-Hyeong Kim
    Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
  • Il-Doo Kim
    Il-Doo Kim
    Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
    More by Il-Doo Kim
  • Dmitry Kireev
    Dmitry Kireev
    Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
    Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
  • Lingxuan Kong
    Lingxuan Kong
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
  • Chengkuo Lee
    Chengkuo Lee
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
    Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
    National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
    NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore
    More by Chengkuo Lee
  • Nae-Eung Lee
    Nae-Eung Lee
    School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
    More by Nae-Eung Lee
  • Pooi See Lee
    Pooi See Lee
    School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
    Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore
    More by Pooi See Lee
  • Tae-Woo Lee
    Tae-Woo Lee
    Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
    School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
    Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea
    Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
    More by Tae-Woo Lee
  • Fengyu Li
    Fengyu Li
    College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
    More by Fengyu Li
  • Jinxing Li
    Jinxing Li
    Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
    More by Jinxing Li
  • Cuiyuan Liang
    Cuiyuan Liang
    School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
  • Chwee Teck Lim
    Chwee Teck Lim
    Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
    Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore
    Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore
  • Yuanjing Lin
    Yuanjing Lin
    School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
    More by Yuanjing Lin
  • Darren J. Lipomi
    Darren J. Lipomi
    Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
  • Jia Liu
    Jia Liu
    John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
    More by Jia Liu
  • Kai Liu
    Kai Liu
    School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
    More by Kai Liu
  • Nan Liu
    Nan Liu
    Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
    More by Nan Liu
  • Ren Liu
    Ren Liu
    John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
    More by Ren Liu
  • Yuxin Liu
    Yuxin Liu
    Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
    More by Yuxin Liu
  • Yuxuan Liu
    Yuxuan Liu
    Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
    More by Yuxuan Liu
  • Zhiyuan Liu
    Zhiyuan Liu
    Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
    More by Zhiyuan Liu
  • Zhuangjian Liu
    Zhuangjian Liu
    Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
  • Xian Jun Loh
    Xian Jun Loh
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
    More by Xian Jun Loh
  • Nanshu Lu
    Nanshu Lu
    Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
    More by Nanshu Lu
  • Zhisheng Lv
    Zhisheng Lv
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
    More by Zhisheng Lv
  • Shlomo Magdassi
    Shlomo Magdassi
    Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
  • George G. Malliaras
    George G. Malliaras
    Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
  • Naoji Matsuhisa
    Naoji Matsuhisa
    Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan;
  • Arokia Nathan
    Arokia Nathan
    Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
  • Simiao Niu
    Simiao Niu
    Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
    More by Simiao Niu
  • Jieming Pan
    Jieming Pan
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
    More by Jieming Pan
  • Changhyun Pang
    Changhyun Pang
    School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
  • Qibing Pei
    Qibing Pei
    Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
    More by Qibing Pei
  • Huisheng Peng
    Huisheng Peng
    State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
  • Dianpeng Qi
    Dianpeng Qi
    School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
    More by Dianpeng Qi
  • Huaying Ren
    Huaying Ren
    Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
    More by Huaying Ren
  • John A. Rogers
    John A. Rogers
    Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
    Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
  • Aaron Rowe
    Aaron Rowe
    Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
    Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States
    More by Aaron Rowe
  • Oliver G. Schmidt
    Oliver G. Schmidt
    Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
    Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany
    Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany
  • Tsuyoshi Sekitani
    Tsuyoshi Sekitani
    The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
  • Dae-Gyo Seo
    Dae-Gyo Seo
    Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
    More by Dae-Gyo Seo
  • Guozhen Shen
    Guozhen Shen
    School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
    More by Guozhen Shen
  • Xing Sheng
    Xing Sheng
    Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
    More by Xing Sheng
  • Qiongfeng Shi
    Qiongfeng Shi
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
    Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
    National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
  • Takao Someya
    Takao Someya
    Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
    More by Takao Someya
  • Yanlin Song
    Yanlin Song
    Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
    More by Yanlin Song
  • Eleni Stavrinidou
    Eleni Stavrinidou
    Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
  • Meng Su
    Meng Su
    Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
    More by Meng Su
  • Xuemei Sun
    Xuemei Sun
    State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
    More by Xuemei Sun
  • Kuniharu Takei
    Kuniharu Takei
    Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
  • Xiao-Ming Tao
    Xiao-Ming Tao
    Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
  • Benjamin C. K. Tee
    Benjamin C. K. Tee
    Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
    iHealthtech, National University of Singapore, Singapore 119276, Singapore
  • Aaron Voon-Yew Thean
    Aaron Voon-Yew Thean
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
    Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
  • Tran Quang Trung
    Tran Quang Trung
    School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
  • Changjin Wan
    Changjin Wan
    School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
    More by Changjin Wan
  • Huiliang Wang
    Huiliang Wang
    Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
  • Joseph Wang
    Joseph Wang
    Department of Nanoengineering, University of California, San Diego, California 92093, United States
    More by Joseph Wang
  • Ming Wang
    Ming Wang
    Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
    the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China
    More by Ming Wang
  • Sihong Wang
    Sihong Wang
    Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
    More by Sihong Wang
  • Ting Wang
    Ting Wang
    State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
    More by Ting Wang
  • Zhong Lin Wang
    Zhong Lin Wang
    Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
    Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States
  • Paul S. Weiss
    Paul S. Weiss
    California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Hanqi Wen
    Hanqi Wen
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
    Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000
    More by Hanqi Wen
  • Sheng Xu
    Sheng Xu
    Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
    More by Sheng Xu
  • Tailin Xu
    Tailin Xu
    School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
    More by Tailin Xu
  • Hongping Yan
    Hongping Yan
    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
    More by Hongping Yan
  • Xuzhou Yan
    Xuzhou Yan
    School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
    More by Xuzhou Yan
  • Hui Yang
    Hui Yang
    Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
    More by Hui Yang
  • Le Yang
    Le Yang
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
    Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore
    More by Le Yang
  • Shuaijian Yang
    Shuaijian Yang
    School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
  • Lan Yin
    Lan Yin
    School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
    More by Lan Yin
  • Cunjiang Yu
    Cunjiang Yu
    Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
    More by Cunjiang Yu
  • Guihua Yu
    Guihua Yu
    Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
    More by Guihua Yu
  • Jing Yu
    Jing Yu
    School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
    More by Jing Yu
  • Shu-Hong Yu
    Shu-Hong Yu
    Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
    More by Shu-Hong Yu
  • Xinge Yu
    Xinge Yu
    Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
    More by Xinge Yu
  • Evgeny Zamburg
    Evgeny Zamburg
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
    Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
  • Haixia Zhang
    Haixia Zhang
    National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
    More by Haixia Zhang
  • Xiangyu Zhang
    Xiangyu Zhang
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
    Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
  • Xiaosheng Zhang
    Xiaosheng Zhang
    School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
  • Xueji Zhang
    Xueji Zhang
    School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
    More by Xueji Zhang
  • Yihui Zhang
    Yihui Zhang
    Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
    More by Yihui Zhang
  • Yu Zhang
    Yu Zhang
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
    Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
    More by Yu Zhang
  • Siyuan Zhao
    Siyuan Zhao
    John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
    More by Siyuan Zhao
  • Xuanhe Zhao
    Xuanhe Zhao
    Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
    More by Xuanhe Zhao
  • Yuanjin Zheng
    Yuanjin Zheng
    Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
  • Yu-Qing Zheng
    Yu-Qing Zheng
    National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
  • Zijian Zheng
    Zijian Zheng
    Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
    More by Zijian Zheng
  • Tao Zhou
    Tao Zhou
    Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
    More by Tao Zhou
  • Bowen Zhu
    Bowen Zhu
    Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
    More by Bowen Zhu
  • Ming Zhu
    Ming Zhu
    Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
    More by Ming Zhu
  • Rong Zhu
    Rong Zhu
    Department of Precision Instrument, Tsinghua University, Beijing 100084, China
    More by Rong Zhu
  • Yangzhi Zhu
    Yangzhi Zhu
    Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
    More by Yangzhi Zhu
  • Yong Zhu
    Yong Zhu
    Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
    More by Yong Zhu
  • Guijin Zou
    Guijin Zou
    Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
    More by Guijin Zou
  • Xiaodong Chen*
    Xiaodong Chen
    Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
    *Email: [email protected]
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ACS Nano

Cite this: ACS Nano 2023, 17, 6, 5211–5295
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https://doi.org/10.1021/acsnano.2c12606
Published March 9, 2023
© 2023 American Chemical Society

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Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.

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Published March 9, 2023
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