Origins of Fermi Level Pinning for Ni and Ag Metal Contacts on Tungsten DichalcogenidesClick to copy article linkArticle link copied!
- Xinglu WangXinglu WangDepartment of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United StatesMore by Xinglu Wang
- Yaoqiao HuYaoqiao HuDepartment of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United StatesMore by Yaoqiao Hu
- Seong Yeoul KimSeong Yeoul KimDepartment of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United StatesMore by Seong Yeoul Kim
- Rafik AddouRafik AddouDepartment of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United StatesMore by Rafik Addou
- Kyeongjae ChoKyeongjae ChoDepartment of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United StatesMore by Kyeongjae Cho
- Robert M. Wallace*Robert M. Wallace*E-mail: [email protected]Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United StatesMore by Robert M. Wallace
Abstract
Tungsten transition metal dichalcogenides (W-TMDs) are intriguing due to their properties and potential for application in next-generation electronic devices. However, strong Fermi level (EF) pinning manifests at the metal/W-TMD interfaces, which could tremendously restrain the carrier injection into the channel. In this work, we illustrate the origins of EF pinning for Ni and Ag contacts on W-TMDs by considering interface chemistry, band alignment, impurities, and imperfections of W-TMDs, contact metal adsorption mechanism, and the resultant electronic structure. We conclude that the origins of EF pinning at a covalent contact metal/W-TMD interface, such as Ni/W-TMDs, can be attributed to defects, impurities, and interface reaction products. In contrast, for a van der Waals contact metal/TMD system such as Ag/W-TMDs, the primary factor responsible for EF pinning is the electronic modification of the TMDs resulting from the defects and impurities with the minor impact of metal-induced gap states. The potential strategies for carefully engineering the metal deposition approach are also discussed. This work unveils the origins of EF pinning at metal/TMD interfaces experimentally and theoretically and provides guidance on further enhancing and improving the device performance.
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