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High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

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† # School of Electrical and Electronic Engineering and #School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
CNRS-International NTU Thales Research Alliance (CINTRA) UMI 3288, Research Techno Plaza, 50 Nanyang Drive, Singapore 637553, Singapore
§ Temasek Laboratories@NTU, 50 Nanyang Avenue, Singapore 639798, Singapore
Institute of Microelectronics, Agency for Science, Technology and Research (A*Star), 11 Science Park Road, Singapore 117685, Singapore
*E-mail (E. H. T. Teo): [email protected]
Cite this: ACS Nano 2017, 11, 2, 2033–2044
Publication Date (Web):February 3, 2017
https://doi.org/10.1021/acsnano.6b08218
Copyright © 2017 American Chemical Society

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    Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m–1 K–1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by ΔT of 44–24 °C).

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