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    Multimodal Sensing with a Three-Dimensional Piezoresistive Structure
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    • Sang Min Won
      Sang Min Won
      Department of Electrical and Computer Engineering  and  Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
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    • Heling Wang
      Heling Wang
      Department of Mechanical Engineering,  Department of Civil and Environmental Engineering,  Department of Materials Science and Engineering  and  Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
      More by Heling Wang
    • Bong Hoon Kim
      Bong Hoon Kim
      Department of Organic Materials and Fiber Engineering, Smart Wearable Engineering, Information Communication Materials, and Convergence Technology, Soongsil University, 369 Sangdo-ro, Dongjak-gu, Seoul 06978, Republic of Korea
      More by Bong Hoon Kim
      Orcidhttp://orcid.org/0000-0002-4610-0176
    • KunHyuck Lee
      KunHyuck Lee
      Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
      More by KunHyuck Lee
    • Hokyung Jang
      Hokyung Jang
      Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
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    • Kyeongha Kwon
      Kyeongha Kwon
      Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
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    • Mengdi Han
      Mengdi Han
      Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
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    • Kaitlyn E. Crawford
      Kaitlyn E. Crawford
      Department of Materials Science and Engineering, University of Central Florida, Orlando, Florida 32816, United States
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      Orcidhttp://orcid.org/0000-0001-7396-6349
    • Haibo Li
      Haibo Li
      Department of Mechanical Engineering,  Department of Civil and Environmental Engineering,  Department of Materials Science and Engineering  and  Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
      More by Haibo Li
    • Yechan Lee
      Yechan Lee
      Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
      More by Yechan Lee
    • Xuebo Yuan
      Xuebo Yuan
      Department of Mechanical Engineering,  Department of Civil and Environmental Engineering,  Department of Materials Science and Engineering  and  Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
      More by Xuebo Yuan
    • Sung Bong Kim
      Sung Bong Kim
      Frederick Seitz Materials Research Laboratory  and  Department of Materials Science and Engineering, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
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    • Yong Suk Oh
      Yong Suk Oh
      Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
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    • Woo Jin Jang
      Woo Jin Jang
      Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
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    • Jong Yoon Lee
      Jong Yoon Lee
      Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
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    • Seungyong Han
      Seungyong Han
      Department of Mechanical Engineering, Ajou University, Suwon 16499, Republic of Korea
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    • Jeonghyun Kim
      Jeonghyun Kim
      Department of Electronics Convergence Engineering, Kwangwoon University, Seoul 01897, Republic of Korea
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    • Xueju Wang
      Xueju Wang
      Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, Missouri 65201, United States
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    • Zhaoqian Xie
      Zhaoqian Xie
      Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China
      More by Zhaoqian Xie
    • Yihui Zhang
      Yihui Zhang
      Center for Flexible Electronics Technology and Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
      More by Yihui Zhang
      Orcidhttp://orcid.org/0000-0003-0885-2067
    • Yonggang Huang
      Yonggang Huang
      Department of Mechanical Engineering,  Department of Civil and Environmental Engineering,  Department of Materials Science and Engineering  and  Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
      More by Yonggang Huang
    • John A. Rogers*
      John A. Rogers
      Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
      Center for Bio-Integrated Electronics, Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, and Neurological Surgery, Simpson Querrey Institute for Nano/biotechnology, McCormick School of Engineering and Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, United States
      *(J.A.R.) E-mail: [email protected]
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      Orcidhttp://orcid.org/0000-0002-2980-3961
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    ACS Nano

    Cite this: ACS Nano 2019, 13, 10, 10972–10979
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    https://doi.org/10.1021/acsnano.9b02030
    Published May 24, 2019
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    Abstract

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    Sensors that reproduce the complex characteristics of cutaneous receptors in the skin have important potential in the context of artificial systems for controlled interactions with the physical environment. Multimodal responses with high sensitivity and wide dynamic range are essential for many such applications. This report introduces a simple, three-dimensional type of microelectromechanical sensor that incorporates monocrystalline silicon nanomembranes as piezoresistive elements in a configuration that enables separate, simultaneous measurements of multiple mechanical stimuli, such as normal force, shear force, and bending, along with temperature. The technology provides high sensitivity measurements with millisecond response times, as supported by quantitative simulations. The fabrication and assembly processes allow scalable production of interconnected arrays of such devices with capabilities in spatiotemporal mapping. Integration with wireless data recording and transmission electronics allows operation with standard consumer devices.

    Copyright © 2019 American Chemical Society

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    The Supporting Information is available free of charge on the ACS Publications website at DOI: 10.1021/acsnano.9b02030.

    • Supplementary note describing finite element analysis and analytical modeling for simultaneous determination of pressure, shear force, and temperature and figures including details of finite elemental analysis modeling, fabrication process, frequency responses to various pressure inputs, fabrication of a sensor array, layout information for the wireless electronics, and design with five sensing elements for simultaneous measurement of temperature pressure and shear forces (PDF)

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