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Dual-Conductive and Stiffness-Morphing Microneedle Patch Enables Continuous In Planta Monitoring of Electrophysiological Signal and Ion Fluctuation

  • Lingxuan Kong
    Lingxuan Kong
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
  • Hanqi Wen
    Hanqi Wen
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
    Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang 314000, China
    More by Hanqi Wen
  • Yifei Luo
    Yifei Luo
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Singapore
    More by Yifei Luo
  • Xiaodong Chen
    Xiaodong Chen
    Innovative Center for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
    Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, Singapore 636921, Singapore
  • Xing Sheng
    Xing Sheng
    Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
    More by Xing Sheng
  • Yuxin Liu*
    Yuxin Liu
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Singapore
    Department of Biomedical Engineering, College of Design and Engineering, 4 Engineering Drive 3, National University of Singapore, Singapore 117583, Singapore
    Institute for Health Innovation & TechnologyiHealthtech, National University of Singapore, Singapore 117599, Singapore
    The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
    *Email: [email protected]. Phone: +65 65660182.
    More by Yuxin Liu
  • , and 
  • Peng Chen*
    Peng Chen
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
    Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, Singapore 636921, Singapore
    *Email: [email protected]. Phone: +65 65141086.
    More by Peng Chen
Cite this: ACS Appl. Mater. Interfaces 2023, 15, 37, 43515–43523
Publication Date (Web):September 7, 2023
https://doi.org/10.1021/acsami.3c08783
Copyright © 2023 American Chemical Society

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    Abstract

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    The use of conductive microneedles presents a promising solution for achieving high-fidelity electrophysiological recordings with minimal impact on the interfaced tissue. However, a conventional metal-based microneedle suffers from high electrochemical impedance and mechanical mismatch. In this paper, we report a dual-conductive (i.e., both ionic and electronic conductive) and stiffness-morphing microneedle patch (DSMNP) for high-fidelity electrophysiological recordings with reduced tissue damage. The polymeric network of the DSMNP facilitates electrolyte absorption and therefore allows the transition of stiffness from 6.82 to 0.5139 N m–1. Furthermore, the nanoporous conductive polymer increases the specific electrochemical surface area after tissue penetration, resulting in an ultralow specific impedance of 893.13 Ω mm2 at 100 Hz. DSMNPs detect variation potential and action potential in real time and cation fluctuations in plants in response to environmental stimuli. After swelling, DSMNPs mechanically “lock” into biological tissues and prevent motion artifact by providing a stable interface. These results demonstrate the potential of DSMNPs for various applications in the field of plant physiology research and smart agriculture.

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    The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsami.3c08783.

    • Illustration of DSMNP fabrication; SEM image of DSMNP; EIS of DSMNP; EDS analysis of DSMNP; mechanical compression test of DSMNP before and after penetration; area-specific impedance (at 10 Hz) of DSMNP change after penetration; resistant variation when different bending angles are applied; EIS fitting of DSMNP- and Ag wire-leaf interface; EIS of DSMNP- and Ag wire-agarose interface with model fitting; FTIR spectra of pristine PEDOT:PSS and DMSO-doped PEDOT:PSS; wind-induced motion artifact RMS of DSMNP and Ag wire; comparison of VPs induced by flame-burning and MW; cell constants for DSMNP conductivity calculation; EIS fitting parameters of DSMNP; EIS fitting parameters of DSMNP- and Ag wire-leaf interfaces; and EIS fitting parameters of DSMNP- and Ag wire-agarose interfaces (PDF)

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