Tailored 2D/3D Halide Perovskite Heterointerface for Substantially Enhanced Endurance in Conducting Bridge Resistive Switching MemoryClick to copy article linkArticle link copied!
- SangMyeong LeeSangMyeong LeeSchool of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of KoreaMore by SangMyeong Lee
- Hyojung KimHyojung KimDepartment of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of KoreaMore by Hyojung Kim
- Dong Hoe KimDong Hoe KimDepartment of Nanotechnology & Advanced Materials Engineering, Sejong University, Seoul 05006, Republic of KoreaMore by Dong Hoe Kim
- Won Bin KimWon Bin KimSchool of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of KoreaMore by Won Bin Kim
- Jae Myeong LeeJae Myeong LeeSchool of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of KoreaMore by Jae Myeong Lee
- Jaeho ChoiJaeho ChoiDepartment of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of KoreaMore by Jaeho Choi
- Hyunjung ShinHyunjung ShinDepartment of Energy Science, Sungkyunkwan University, Suwon 16419, Republic of KoreaMore by Hyunjung Shin
- Gill Sang Han*Gill Sang Han*Email: [email protected]School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of KoreaMore by Gill Sang Han
- Ho Won Jang*Ho Won Jang*Email: [email protected]Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of KoreaMore by Ho Won Jang
- Hyun Suk Jung*Hyun Suk Jung*Email: [email protected]School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Republic of KoreaMore by Hyun Suk Jung
Abstract

Hybrid organic–inorganic halide perovskites (HPs) have garnered significant attention for use in resistive switching (RS) memory devices due to their low cost, low operation voltage, high on/off ratio, and excellent mechanical properties. However, the HP-based RS memory devices continue to face several challenges owing to the short endurance and stability of the HP film. Herein, two-dimensional/three-dimensional (2D/3D) perovskite heterojunction films were prepared via a low-temperature all-solution process and their RS behavior was investigated for the first time. The 2D/3D perovskite RS devices exhibited excellent performance with an endurance of 2700 cycles, a high on/off ratio of 106, and an operation speed of 640 μs. The calculated thermally assisted ion hopping activation energy and the results of the time-of-flight secondary ion mass spectroscopy demonstrated that the 2D perovskite layer could efficiently prevent the Ag ion migration into the 3D perovskite film. Moreover, we found that owing to its high thermal conductivity, the 2D perovskite can control the rupture of the Ag conductive filament. Thus, the 2D perovskite layer enhances endurance by controlling both Ag migration and filament rupture. Hence, this study provides an alternate strategy for improving endurance of HP-based RS memory devices.
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