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Organic Layers Bonded to Industrial, Coinage, and Noble Metals through Electrochemical Reduction of Aryldiazonium Salts

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Laboratoire d'Electrochimie Moléculaire, Université Paris 7-Denis Diderot, Unité Mixte de Recherche Université Paris 7-CNRS 7591, 2 Place Jussieu, 75251 Paris Cedex 05, France, ITODYS, Université Paris 7-Denis Diderot, Unité Mixte de Recherche Université Paris 7-CNRS 7086, 1 rue Guy de la Brosse, F-75005 Paris, France, Laboratoire Analyse et Environnement de l'Université Evry-Val d'Essonne, Unité Mixte de Recherche Université d'Evry-CNRS-CEA 8587, Université d'Evry, rue du Père Jarland, 91025 Evry, France, and Laboratoire de Physique des Liquides et Electrochimie, Unité Propre de Recherche CNRS 15, Conventionné avec l'Université Pierre et Marie Curie, 4 Place Jussieu, F-75004 Paris, France
Cite this: Chem. Mater. 2003, 15, 18, 3450–3462
Publication Date (Web):August 9, 2003
https://doi.org/10.1021/cm034167d
Copyright © 2003 American Chemical Society

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    Abstract

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    The reduction of diazonium salts in an aprotic medium permits the attachment of substituted aryl groups to a variety of metals:  Co, Ni, Cu, Zn, Pt, and Au. These aryl groups are strongly bonded to the metal as they resist sustained rinsing under sonication in organic solvents. The organic layers have been characterized by cyclic voltammetry, infrared reflection absorption spectroscopy, X-ray photoelectron spectroscopy, Rutherford backscattering, electrochemical impedance spectroscopy, and atomic force microscopy. From these data it is possible to propose a structure for these grafted layers.

     Unité Propre de Recherche CNRS 15.

    §

     Unité Mixte de Recherche Université d'Evry-CNRS-CEA 8587.

     Unité Mixte de Recherche Université Paris 7-CNRS 7591.

     Unité Mixte de Recherche Université Paris 7-CNRS 7086.

    *

     To whom correspondence should be addressed.

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    Figure S1 (cyclic voltammetry of anthraquinone groups attached to the surface of copper), Figure S2 (cyclic voltammetry of nitrophenyl groups attached to the surface of copper), and Figure S3 (AFM depth profile of Figure 2c) (PDF). This material is available free of charge via the Internet at http://pubs.acs.org.

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