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Thin Film Receiver Materials for Deterministic Assembly by Transfer Printing

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Center for Neuroscience Imaging Research (CNIR), Institute of Basic Science (IBS), School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 440-746, Korea
R&I Korea, Solvay Special Chemicals, Solvay Korea Co. LTD, Seoul 120-750, Korea
§ Department of Electrical and Computer Engineering, University of Wisconsin—Madison, Madison, Wisconsin 53706, United States
∥ ⊥ # Department of Materials Science and Engineering, Department of Electrical Computer and Engineering, and #Chemistry, Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States
Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta T6G 2V4, Canada
*E-mail: [email protected] (T.-i.K.).
*E-mail: [email protected] (J.A.R.).
Cite this: Chem. Mater. 2014, 26, 11, 3502–3507
Publication Date (Web):May 30, 2014
https://doi.org/10.1021/cm501002b
Copyright © 2014 American Chemical Society

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    Abstract

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    We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelectronics, and other areas of interest.

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