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A Nonlithographic Top-Down Electrochemical Approach for Creating Hierarchical (Micro−Nano) Superhydrophobic Silicon Surfaces

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School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907
Cite this: Langmuir 2007, 23, 5, 2300–2303
Publication Date (Web):February 1, 2007
https://doi.org/10.1021/la063230l
Copyright © 2007 American Chemical Society

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    Abstract

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    Superhydrophobic surfaces are biomimetic structures with potential applications in several key technological areas. In the past decade, several top-down and bottom-up fabrication methods have been developed to create such surfaces. These typically combine a hierarchical structure and low surface energy coatings to increase the contact angle and decrease the rolling angles. Silicon-based superhydrophobic surfaces are particularly attractive since they can be integrated with active electronics in order to protect them from the detrimental effects of environmental water and moisture. In this work, we introduce a simple and inexpensive process incorporating electrochemical surface modification (to create a fractal shape micro−nano topography) in combination with a final wet etching step to fabricate a superhydrophobic silicon surface with a contact angle of 160° and a sliding angle of less than 1°.

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     Corresponding author. Phone:  (765) 494-0725. E-mail:  bziaie@ purdue.edu.

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