Synthesis and Thermal Study of Hexacoordinated Aluminum(III) Triazenides for Use in Atomic Layer DepositionClick to copy article linkArticle link copied!
- Rouzbeh SamiiRouzbeh SamiiDepartment of Physics, Chemistry and Biology, Linköping University, SE-581 83 Linköping, SwedenMore by Rouzbeh Samii
- David ZandersDavid ZandersFaculty of Chemistry and Biochemistry, Ruhr University Bochum, Universitätsstraße 150, 44801 Bochum, GermanyDepartment of Chemistry, Carleton University, 1125 Colonel By Drive, Ottawa, Ontario K1S5B6, CanadaMore by David Zanders
- Sydney C. ButteraSydney C. ButteraDepartment of Chemistry, Carleton University, 1125 Colonel By Drive, Ottawa, Ontario K1S5B6, CanadaMore by Sydney C. Buttera
- Vadim KesslerVadim KesslerDepartment of Molecular Sciences, Swedish University of Agricultural Sciences, P.O. Box 7015, 75007 Uppsala, SwedenMore by Vadim Kessler
- Lars OjamäeLars OjamäeDepartment of Physics, Chemistry and Biology, Linköping University, SE-581 83 Linköping, SwedenMore by Lars Ojamäe
- Henrik PedersenHenrik PedersenDepartment of Physics, Chemistry and Biology, Linköping University, SE-581 83 Linköping, SwedenMore by Henrik Pedersen
- Nathan J. O’Brien*Nathan J. O’Brien*E-mail: [email protected]Department of Physics, Chemistry and Biology, Linköping University, SE-581 83 Linköping, SwedenMore by Nathan J. O’Brien
Abstract
Amidinate and guanidinate ligands have been used extensively to produce volatile and thermally stable precursors for atomic layer deposition. The triazenide ligand is relatively unexplored as an alternative ligand system. Herein, we present six new Al(III) complexes bearing three sets of a 1,3-dialkyltriazenide ligand. These complexes volatilize quantitatively in a single step with onset volatilization temperatures of ∼150 °C and 1 Torr vapor pressures of ∼134 °C. Differential scanning calorimetry revealed that these Al(III) complexes exhibited exothermic events that overlapped with the temperatures of their mass loss events in thermogravimetric analysis. Using quantum chemical density functional theory computations, we found a decomposition pathway that transforms the relatively large hexacoordinated Al(III) precursor into a smaller dicoordinated complex. The pathway relies on previously unexplored interligand proton migrations. These new Al(III) triazenides provide a series of alternative precursors with unique thermal properties that could be highly advantageous for vapor deposition processes of Al containing materials.
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Synopsis
Six aluminum(III) 1,3-dialkyltriazenides were synthesized and their thermal properties explored. The compounds were purified by recrystallization and could be easily sublimed. Thermogravimetric analysis of compounds showed that all, except one, gave a single step evaporation with onset volatilization temperatures of ∼150 °C. DFT calculations revealed a unique decomposition pathway that leads to a small and more reactive Al species that would be highly advantageous for the surface reactions of atomic layer deposition.
1. Introduction
2. Results and Discussion
2.1. Synthesis and Characterization of Aluminum Complexes
Scheme 1
Figure 1
Figure 1. ORTEP drawing for one of two independent molecules in the unit cell of 6. Thermal ellipsoids are displayed at the 50% probability level, and hydrogen atoms are omitted for clarity.
Figure 2
Figure 2. (a) HOMO (−5.74 eV) and (b) LUMO (−0.78 eV) for 6 from DFT calculations.
2.2. Thermal Analysis of Aluminum Complexes
Figure 3
Figure 3. Thermogravimetric analysis of 1–6.
1st DSC exotherm (°C) | onset of volatilization (°C) | 1 Torr vapor pressure (°C) | residual mass (%) | sublimation tempa (°C) | |
---|---|---|---|---|---|
1 | 150–230 | 155 | 134 | 2 | 90 |
2 | 130–190 | 153 | 138 | 4 | 90 |
3 | 160–300 | 161 | 137 | 2 | 105 |
4 | 105–160 | N/A | N/A | 7 | 90 |
5 | 160–240 | 175 | 172 | 0 | 120 |
6 | 230–280 | 151 | 134 | 0 | 125 |
Vacuum sublimation was undertaken at 0.5 mbar.
Figure 4
Figure 4. The 1H NMR (500 MHz, C6D6) spectra from a decomposition study of 1 between 0.8–1.3 and 3.7–4.0 ppm separated by an axis break. For visibility, the y-axis is scaled up ∼18 times on the left of the axis break compared to the right side. Prior to flame sealing, the compound showed no traces of impurities by 1H NMR analysis. The peaks marked with an asterisk appeared after flame sealing the tube. Compound 1 was heated in C6D6, and all spectra were acquired at 50 °C to suppress line broadening. The decomposition of 1 accelerates after 210 °C, which is shown by the diminished quartet and doublet peaks.
2.3. Gas-Phase Decomposition by DFT Computations
Figure 5
Figure 5. Free energy profile (at 250 °C and 10 hPa) for the first half of the decomposition pathway. Here, 1 loses a triazene ligand (after TS-2), and one ligand decomposes into an imido ligand (TS-5). TS-3 has the largest free energy (211 kJmol–1) for the displayed part of the decomposition pathway. The overall largest free energy barrier is found at TS-8 (214 kJmol–1): the analogous step to TS-3 but for the last ligand. At 250 °C and 10 hPa, the adduct structures I-2A separate spontaneously (i.e., the process is barrierless and has a negative free energy difference) and is therefore not included.
Figure 6
Figure 6. Free energy profile continuing from I-5. The steps that transform I-5 into I-10 are analogous to the steps that transform 1 into I-5. The reverse step through TS-7 has a significantly larger free energy barrier compared to the analogous TS-2 (290 vs 85 kJ mol–1, respectively).
Scheme 2
aThe I-2 intermediate has one monoanionic N,N-coordinated and one dianionic C,N-coordinated triazenide ligand.

3. Conclusion
4. Experimental Section
4.1. General Experimental Procedures
4.2. General Synthesis Procedure for Al(III) Triazenide Complexes
Tris(1,3-diisopropyltriazenide)aluminum(III) (1)
Tris(1-isopropyl-3-sec-butyltriazenide)aluminum(III) (2)
Tris(1-isopropyl-3-tert-butyltriazenide)aluminum(III) (3)
Tris(1,3-di-sec-butyltriazenide)aluminum(III) (4)
Tris(1-sec-butyl-3-tert-butyltriazenide)aluminum(III) (5)
Tris(1,3-di-tert-butyltriazenide)aluminum(III) (6)
4.3. X-ray Crystallographic Analysis
4.4. Thermogravimetric Analysis
4.5. Differential Scanning Calorimetry Analysis
4.6. Quantum-Chemical Computations
Supporting Information
The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acs.inorgchem.0c03496.
Characterization of the compounds and computational calculation details (PDF)
Compound 1 (CIF)
Compound 6 (CIF)
CCDC 2046808 contains the supplementary crystallographic data for this paper. These data can be obtained free of charge via www.ccdc.cam.ac.uk/data_request/cif, or by emailing [email protected], or by contacting The Cambridge Crystallographic Data Centre, 12 Union Road, Cambridge CB2 1EZ, UK; fax: +44 1223 336033.
Terms & Conditions
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Acknowledgments
The authors acknowledge Seán Barry for access to TGA and DSC instruments. This project was funded by the Swedish foundation for Strategic Research through the project “Time-resolved low temperature CVD for III-nitrides” (SSF-RMA 15-0018) and by the Knut and Alice Wallenberg foundation through the project “Bridging the THz gap” (KAW 2013.0049). L.O. acknowledges financial support from the Swedish Government Strategic Research Area in Materials Science on Functional Materials at Linköping University (Faculty Grant SFO Mat LiU 2009 00971). Supercomputing resources were provided by the Swedish National Infrastructure for Computing (SNIC) and the Swedish National Supercomputer Centre (NSC).
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- 2Li, J.; Nam, K. B.; Nakarmi, M. L.; Lin, J. Y.; Jiang, H. X.; Carrier, P.; Wei, S.-H. Band Structure and Fundamental Optical Transitions in Wurtzite AlN. Appl. Phys. Lett. 2003, 83, 5163– 5165, DOI: 10.1063/1.1633965Google Scholar2Band structure and fundamental optical transitions in wurtzite AlNLi, J.; Nam, K. B.; Nakarmi, M. L.; Lin, J. Y.; Jiang, H. X.; Carrier, Pierre; Wei, Su-HuaiApplied Physics Letters (2003), 83 (25), 5163-5165CODEN: APPLAB; ISSN:0003-6951. (American Institute of Physics)With a recently developed unique deep UV picoseconds time-resolved photoluminescence (PL) spectroscopy system and improved growth technique, the authors are able to det. the detailed band structure near the Γ point of wurtzite (WZ) AlN with a direct band gap of 6.12 eV. Combined with 1st-principles band structure calcns. the fundamental optical properties of AlN differ drastically from that of GaN and other WZ semiconductors. The discrepancy in energy band gap values of AlN obtained previously by different methods is explained in terms of the optical selection rules in AlN and is confirmed by measurement of the polarization dependence of the excitonic PL spectra.
- 3George, S. M. Atomic Layer Deposition: An Overview. Chem. Rev. 2010, 110, 111– 131, DOI: 10.1021/cr900056bGoogle Scholar3Atomic Layer Deposition: An OverviewGeorge, Steven M.Chemical Reviews (Washington, DC, United States) (2010), 110 (1), 111-131CODEN: CHREAY; ISSN:0009-2665. (American Chemical Society)A review. A review on the at. layer deposition and its application to the fabrication of semiconductor device and nanodevices. The nucleation and growth mechanism during at. layer deposition are discussed.
- 4Koponen, S. E.; Gordon, P. G.; Barry, S. T. Principles of Precursor Design for Vapour Deposition Methods. Polyhedron 2016, 108, 59– 66, DOI: 10.1016/j.poly.2015.08.024Google Scholar4Principles of precursor design for vapour deposition methodsKoponen, Sara E.; Gordon, Peter G.; Barry, Sean T.Polyhedron (2016), 108 (), 59-66CODEN: PLYHDE; ISSN:0277-5387. (Elsevier Ltd.)A review. CVD and at. layer deposition (ALD) are attractive techniques for depositing a wide spectrum of thin solid film materials, for a broad spectrum of industrial applications. These techniques rely on volatile, reactive, and thermally stable mol. precursors to transport and deposit growth materials in a kinetically controlled manner, resulting in uniform, conformal, high purity films. Developments in these fields depend on careful precursor design. The qualities that make successful CVD or ALD precursors (low m.p., high volatility, stability and specific reactivity) and the widely applicable design principles used to achieve them, through examples of Group 11 and 13 precursors including amidinates, guanidinates and iminopyrrolidinates are discussed. The authors highlight the most valuable techniques that the authors use to asses potential precursors from the discussed qualities, and to elucidate relevant mechanisms of decompn. and surface reactivity. There is a strong focus on TGA, and solid state (SS) and soln. NMR studies.
- 5Van Bui, H.; Nguyen, M. D.; Wiggers, F. B.; Aarnink, A. A. I.; De Jong, M. P.; Kovalgin, A. Y. Self-Limiting Growth and Thickness- And Temperature- Dependence of Optical Constants of ALD AlN Thin Films. ECS J. Solid State Sci. Technol. 2014, 3, P101– P106, DOI: 10.1149/2.020404jssGoogle Scholar5Self-limiting growth and thickness- and temperature-dependence of optical constants of ALD AlN thin filmsVan Bui, H.; Nguyen, M. D.; Wiggers, F. B.; Aarnink, A. A. I.; de Jong, M. P.; Kovalgin, A. Y.ECS Journal of Solid State Science and Technology (2014), 3 (4), P101-P106CODEN: EJSSBG; ISSN:2162-8769. (Electrochemical Society)We have investigated the growth characteristics and optical consts. of thin AlN films made by thermal at. layer deposition (ALD) from AlMe3 and NH3. We obsd. the nucleation, closure and growth after closure of the films using AFM and in-situ spectroscopic ellipsometry. A fully covered surface was obtained for films with a thickness of about 2 nm. The self-limiting ALD growth was obsd. at temps. of 330 and 350° with deposition rates of 1.5 and 2.1 Å/cycle, resp. At 370°, thermal decompn. of TMA dominated the growth mechanism, resulting in a fast and non-self-limiting deposition. Low concns. of O (0.8-2.5%) and C (5-7.5%) incorporated into the films were measured. We found that the refractive index increased remarkably with increasing film thickness and growth temp.
- 6Riihelä, D.; Ritala, M.; Matero, R.; Leskelä, M.; Jokinen, J.; Haussalo, P. Low Temperature Deposition of AlN Films by an Alternate Supply of Trimethyl Aluminum and Ammonia. Chem. Vap. Deposition 1996, 2, 277– 283, DOI: 10.1002/cvde.19960020612Google ScholarThere is no corresponding record for this reference.
- 7Liu, X.; Ramanathan, S.; Lee, E.; Seidel, T. E. Atomic Layer Deposition of Aluminum Nitride Thin Films from Trimethyl Aluminum (TMA) and Ammonia. MRS Online Proceedings Library 2003, 811, 158– 153, DOI: 10.1557/PROC-811-D1.9Google ScholarThere is no corresponding record for this reference.
- 8Jung, Y. C.; Hwang, S. M.; Le, D. N.; Kondusamy, A. L. N.; Mohan, J.; Kim, S. W.; Kim, J. H.; Lucero, A. T.; Ravichandran, A.; Kim, H. S.; Kim, S. J.; Choi, R.; Ahn, J.; Alvarez, D.; Spiegelman, J.; Kim, J. Low Temperature Thermal Atomic Layer Deposition of Aluminum Nitride Using Hydrazine as the Nitrogen Source. Materials 2020, 13, 3387, DOI: 10.3390/ma13153387Google Scholar8Low temperature thermal atomic layer deposition of aluminum nitride using hydrazine as the nitrogen sourceJung, Yong Chan; Hwang, Su Min; Le, Dan N.; Kondusamy, Aswin L. N.; Mohan, Jaidah; Kim, Sang Woo; Kim, Jin Hyun; Lucero, Antonio T.; Ravichandran, Arul; Kim, Harrison Sejoon; Kim, Si Joon; Choi, Rino; Ahn, Jinho; Alvarez, Daniel; Spiegelman, Jeff; Kim, JiyoungMaterials (2020), 13 (15), 3387CODEN: MATEG9; ISSN:1996-1944. (MDPI AG)Aluminum nitride (AlN) thin films were grown using thermal at. layer deposition in the temp. range of 175-350 °C. The thin films were deposited using tri-Me aluminum (TMA) and hydrazine (N2H4) as a metal precursor and nitrogen source, resp. Highly reactive N2H4, compared to its conventionally used counterpart, ammonia (NH3), provides a higher growth per cycle (GPC), which is approx. 2.3 times higher at a deposition temp. of 300 °C and, also exhibits a low impurity concn. in as-deposited films. Low temp. AlN films deposited at 225 °C with a capping layer had an Al to N compn. ratio of 1:1.1, a close to ideal compn. ratio, with a low oxygen content (7.5%) while exhibiting a GPC of 0.16 nm/cycle. We suggest that N2H4 as a replacement for NH3 is a good alternative due to its stringent thermal budget.
- 9Dendooven, J.; Deduytsche, D.; Musschoot, J.; Vanmeirhaeghe, R. L.; Detavernier, C. Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition. J. Electrochem. Soc. 2010, 157, G111, DOI: 10.1149/1.3301664Google Scholar9Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer DepositionDendooven, J.; Deduytsche, D.; Musschoot, J.; Vanmeirhaeghe, R. L.; Detavernier, C.Journal of the Electrochemical Society (2010), 157 (4), G111-G116CODEN: JESOAN; ISSN:0013-4651. (Electrochemical Society)This paper focuses on the conformality of the plasma-enhanced at. layer deposition (PE-ALD) of Al2O3 using trimethylaluminum [AlMe3; (TMA)] as a precursor and O2 plasma as an oxidant source. The conformality was quantified by measuring the deposited film thickness as a function of depth into macroscopic test structures with aspect ratios of ∼5, 10, and 22. A comparison with the thermal TMA/H2O process indicates that the conformality of the plasma based process is more limited due to the surface recombination of radicals during the plasma step. The conformality can slightly be improved by raising the gas pressure or the radiofrequency power. Prolonging the plasma exposure time results in further improvement of the conformality. Also, there are indications that the H2O produced during the plasma step in the PE-ALD process for Al2O3 contributes to the obsd. conformality through a secondary thermal ALD reaction. The conformality of Al2O3 is also compared to the conformality of AlN deposited by PE-ALD from TMA and NH3 plasma. For the same exposure, O2 plasma results in better conformality compared to NH3 plasma, suggesting a faster recombination of the radicals in the NH3 plasma.
- 10Ozgit, C.; Donmez, I.; Alevli, M.; Biyikli, N. Self-Limiting Low-Temperature Growth of Crystalline AlN Thin Films by Plasma-Enhanced Atomic Layer Deposition. Thin Solid Films 2012, 520, 2750– 2755, DOI: 10.1016/j.tsf.2011.11.081Google Scholar10Self-limiting low-temperature growth of crystalline AlN thin films by plasma-enhanced atomic layer depositionOzgit, Cagla; Donmez, Inci; Alevli, Mustafa; Biyikli, NecmiThin Solid Films (2012), 520 (7), 2750-2755CODEN: THSFAP; ISSN:0040-6090. (Elsevier B.V.)We report on the self-limiting growth and characterization of AlN thin films. AlN films were deposited by plasma-enhanced at. layer deposition on various substrates using AlMe3 and NH3. At 185°, deposition rate satd. for AlMe3 and NH3 doses starting from 0.05 and 40 s, resp. Saturative surface reactions between AlMe3 and NH3 resulted in a const. growth rate of ≈0.86 Å/cycle from 100-200°. Within this temp. range, film thickness increased linearly with the no. of deposition cycles. At higher temps. (≥225°) deposition rate increased with temp. Chem. compn. and bonding states of the films deposited at 185° were investigated by XPS. High resoln. Al 2p and N 1s spectra confirmed the presence of AlN with peaks located at 73.02 and 396.07 eV, resp. Films deposited at 185° were polycryst. with a hexagonal wurtzite structure regardless of the substrate selection as detd. by grazing incidence x-ray diffraction. High-resoln. TEM images of the AlN thin films deposited on Si (100) and glass substrates revealed a microstructure consisting of nanometer sized crystallites. Films exhibited an optical band edge at ≈ 5.8 eV and an optical transmittance of >95% in the visible region of the spectrum.
- 11Ozgit-Akgun, C.; Goldenberg, E.; Okyay, A. K.; Biyikil, N. Hollow Cathode Plasma-Assisted Atomic Layer Deposition of Crystalline AlN, GaN and AlxGa1-XN Thin Films at Low Temperatures. J. Mater. Chem. C 2014, 2, 2123– 2136, DOI: 10.1039/C3TC32418DGoogle Scholar11Hollow cathode plasma-assisted atomic layer deposition of crystalline AlN, GaN and AlxGa1-xN thin films at low temperaturesOzgit-Akgun, Cagla; Goldenberg, Eda; Okyay, Ali Kemal; Biyikli, NecmiJournal of Materials Chemistry C: Materials for Optical and Electronic Devices (2014), 2 (12), 2123-2136CODEN: JMCCCX; ISSN:2050-7534. (Royal Society of Chemistry)The authors report on the use of hollow cathode plasma for low-temp. plasma-assisted at. layer deposition (PA-ALD) of cryst. AlN, GaN and AlxGa1-xN thin films with low impurity concns. Depositions were carried out at 200° using trimethylmetal precursors and NH3 or N2/H2 plasma. XPS showed 2.5-3 at. % O in AlN and 1.5-1.7 at. % O in GaN films deposited using NH3 and N2/H2 plasma, resp. No C impurities were detected within the films. Secondary ion mass spectroscopy analyses performed on the films deposited using NH3 plasma revealed O, C (both <1 at.%), and H impurities. GIXRD patterns indicated polycryst. thin films with wurtzite crystal structure. Hollow cathode PA-ALD parameters were optimized for AlN and GaN thin films using N2/H2 plasma. Trimethylmetal and N2/H2 satn. curves evidenced the self-limiting growth of AlN and GaN at 200°. AlN exhibited linear growth with a growth per cycle (GPC) of ∼1.0 Å. For GaN, the GPC decreased with the increasing no. of deposition cycles, indicating substrate-enhanced growth. The GPC calcd. from a 900-cycle GaN deposition was 0.22 Å. Ellipsometric spectra of the samples were modeled using the Cauchy dispersion function, from which the refractive indexes of 59.2 nm thick AlN and 20.1 nm thick GaN thin films are 1.94 and 2.17 at 632 nm, resp. Spectral transmission measurements of AlN, GaN and AlxGa1-xN thin films grown on double side polished sapphire substrates revealed near-ideal visible transparency with minimal absorption. Optical band edge values of the AlxGa1-xN films shifted to lower wavelengths with the increasing Al content, indicating the tunability of band edge values with the alloy compn.
- 12Bosund, M.; Sajavaara, T.; Laitinen, M.; Huhtio, T.; Putkonen, M.; Airaksinen, V. M.; Lipsanen, H. Properties of AlN Grown by Plasma Enhanced Atomic Layer Deposition. Appl. Surf. Sci. 2011, 257, 7827– 7830, DOI: 10.1016/j.apsusc.2011.04.037Google Scholar12Properties of AlN grown by plasma enhanced atomic layer depositionBosund, Markus; Sajavaara, Timo; Laitinen, Mikko; Huhtio, Teppo; Putkonen, Matti; Airaksinen, Veli-Matti; Lipsanen, HarriApplied Surface Science (2011), 257 (17), 7827-7830CODEN: ASUSEE; ISSN:0169-4332. (Elsevier B.V.)The influence of growth parameters on the properties of AlN films fabricated by plasma-enhanced at. layer deposition using AlEt3 and NH3 precursors was investigated. The at. concns., refractive index, mass d., crystallinity, and surface roughness were studied from the films grown in the temp. range of 100-300° with plasma discharge times between 2.5-30 s. The AlN films were shown to be H-rich having H concns. in the range of 13-27 at.% with inverse dependence on the growth temp. The C and O concns. in the films were <2.6% and 0.2%, resp. The refractive index and mass d. of the films correlated with the H concn. so that higher concns. (lower growth temps.) resulted in smaller refractive index and mass d. The film grown at 300° was found to be cryst. whereas lower growth temp. produced amorphous films.
- 13Nepal, N.; Qadri, S. B.; Hite, J. K.; Mahadik, N. A.; Mastro, M. A.; Eddy, C. R. Epitaxial Growth of {AlN} Films via Plasma-Assisted Atomic Layer Epitaxy. Appl. Phys. Lett. 2013, 103, 82110, DOI: 10.1063/1.4818792Google Scholar13Epitaxial growth of AlN films via plasma-assisted atomic layer epitaxyNepal, N.; Qadri, S. B.; Hite, J. K.; Mahadik, N. A.; Mastro, M. A.; Eddy, C. R., Jr.Applied Physics Letters (2013), 103 (8), 082110/1-082110/5CODEN: APPLAB; ISSN:0003-6951. (American Institute of Physics)Thin AlN layers were grown at 200-650 °C by plasma assisted at. layer epitaxy (PA-ALE) simultaneously on Si(111), sapphire (11-20), and GaN/sapphire substrates. The AlN growth on Si(111) is self-limited for trimethyaluminum (TMA) pulse of length > 0.04 s, using a 10 s purge. However, the AlN nucleation on GaN/sapphire is non-uniform and has a bimodal island size distribution for TMA pulse of ≤0.03 s. The growth rate (GR) remains almost const. for Tg between 300 and 400 °C indicating ALE mode at those temps. The GR is increased by 20% at Tg = 500 °C. Spectroscopic ellipsometry (SE) measurement shows that the ALE AlN layers grown at Tg ≤ 400 °C have no clear band edge related features, however, the theor. estd. band gap of 6.2 eV was measured for AlN grown at Tg ≥ 500 °C. X-ray diffraction measurements on 37 nm thick AlN films grown at optimized growth conditions (Tg = 500 °C, 10 s purge, 0.06 s TMA pulse) reveal that the ALE AlN on GaN/sapphire is (0002) oriented with rocking curve full width at the half max. (FWHM) of 670 arc sec. Epitaxial growth of cryst. AlN layers by PA-ALE at low temps. broadens application of the material in the technologies that require large area conformal growth at low temps. with thickness control at the at. scale. (c) 2013 American Institute of Physics.
- 14Waggoner, K. M.; Olmstead, M. M.; Power, P. P. Structural and Spectroscopic Characterization of the Compounds [Al(NMe2)3]2, [Ga(NMe2)3]2, [(Me2N)2Al{μ-N(H)1-Ad}]2 (1-Ad = 1-Adamantanyl) and [{Me(μ-NPh2)Al}2NPh(μ-C6H4)]. Polyhedron 1990, 9, 257– 263, DOI: 10.1016/S0277-5387(00)80578-1Google Scholar14Structural and spectroscopic characterization of the compounds [Al(NMe2)3]2, [Ga(NMe2)3]2, [(Me2N)2Al{μ-N(H)1-Ad}]2 (1-Ad = 1-adamantanyl) and [{Me(μ-NPh2)Al}2NPh(μ-C6H4)]Waggoner, K. M.; Olmstead, M. M.; Power, P. P.Polyhedron (1990), 9 (2-3), 257-63CODEN: PLYHDE; ISSN:0277-5387.[Al(NMe2)3]2 (I), [Ga(NMe2)3]2 (II), [(Me2N)2Al{μ-1-AdNH}]2 (III; 1-AdNH2 = adamantanylamine) and [{Me(μ-NPh2)Al}2NPh(μ-C6H4)].0.5PhMe (IV) were prepd. and structurally and spectroscopically characterized by x-ray crystallog., 1H, 13C, 27Al, 69Ga and 71Ga NMR. A new synthesis is also provided for the previously known compd. I. The structures of I and II are the 1st reported structures of tris-dialkylamides of Al or Ga. Both possess dimeric structures in the solid with dimethylamide bridges and distorted tetrahedral geometry at the metal. The terminal NMe2 groups display significant deviation from planarity in both compds. The transamination reaction between I and 1 equiv of 1-AdNH2 affords III in high yield. IV was prepd. by treatment of AlMe3 with 2 equiv of HNPh2 in refluxing toluene and is somewhat surprising in view of the prior synthesis of Al(NPh2)3 via a similar reaction. I and II are triclinic, space group P‾1, R = 0.041 and 0.035, resp.; III and IV are monoclinic, space group P21/c, R = 0.047 and 0.066, resp.
- 15Wade, C. R.; Silvernail, C.; Banerjee, C.; Soulet, A.; McAndrew, J.; Belot, J. A. Tris(Dialkylamino)Aluminums: Syntheses, Characterization, Volatility Comparison and Atomic Layer Deposition of Alumina Thin Films. Mater. Lett. 2007, 61, 5079– 5082, DOI: 10.1016/j.matlet.2007.04.009Google Scholar15Tris(dialkylamino)aluminums: Syntheses, characterization, volatility comparison and atomic layer deposition of alumina thin filmsWade, Casey R.; Silvernail, Carter; Banerjee, Chiranjib; Soulet, Axel; McAndrew, James; Belot, John A.Materials Letters (2007), 61 (29), 5079-5082CODEN: MLETDJ; ISSN:0167-577X. (Elsevier B.V.)The syntheses and characterization of both tris(diethylamino)aluminum and tris(diisopropylamino)aluminum are presented. Characterization includes vapor pressure measurements and comparison of the 2 non-pyrophoric precursors showing them to be viable alternatives to trimethylaluminum. Tris(diisopropyl)aluminum was successful in the at. layer deposition of alumina thin films.
- 16Liu, G.; Deguns, E.; Lecordier, L.; Sundaram, G.; Becker, J. Atomic Layer Deposition of AlN with Tris(Dimethylamido)Aluminum and NH. ECS Trans. 2011, 41, 219– 225, DOI: 10.1149/1.3633671Google Scholar16Atomic layer deposition of AlN with tris(dimethylamido)aluminum and NH3Liu, G.; Deguns, E. W.; Lecordier, L.; Sundaram, G.; Becker, J. S.ECS Transactions (2011), 41 (2, Atomic Layer Deposition Applications 7), 219-225CODEN: ECSTF8; ISSN:1938-5862. (Electrochemical Society)Atomic layer deposition of aluminum nitride on Si wafers using tris(dimethylamido)aluminum and ammonia has been investigated in the temp. range from 180 to 400°C. Satd. growth behavior not obsd. with NH3 pulsed in continuous mode has been achieved in NH3 exposure mode. Thin AlN films have been analyzed by spectroscopic ellipsometry and SIMS for optical and chem. properties, X-ray diffraction for crystallinity, and mercury probe for elec. properties. Polycryst. and high purity AlN films have been obtained at 300°C or higher. A high dielec. const. in the range of 7.4-7.7 and high breakdown field of 5.3-5.6 MV/cm with relatively low leakage current in the 10-7 to 10-8 A/cm2 range at 2MV/cm have been obtained for AlN films deposited between 300 and 400°C in NH3 exposure mode.
- 17Kim, K. H.; Gordon, R. G.; Ritenour, A.; Antoniadis, D. A. Atomic Layer Deposition of Insulating Nitride Interfacial Layers for Germanium Metal Oxide Semiconductor Field Effect Transistors with High-κ Oxide/Tungsten Nitride Gate Stacks. Appl. Phys. Lett. 2007, 90, 212104, DOI: 10.1063/1.2741609Google Scholar17Atomic layer deposition of insulating nitride interfacial layers for germanium metal oxide semiconductor field effect transistors with high-κ oxide/tungsten nitride gate stacksKim, Kyoung H.; Gordon, Roy G.; Ritenour, Andrew; Antoniadis, Dimitri A.Applied Physics Letters (2007), 90 (21), 212104/1-212104/3CODEN: APPLAB; ISSN:0003-6951. (American Institute of Physics)At. layer deposition (ALD) was used to deposit passivating interfacial nitride layers between Ge and high-κ oxides. High-κ oxides on Ge surfaces passivated by ultrathin (1-2 nm) ALD Hf3N4 or AlN layers exhibited well-behaved C-V characteristics with an equiv. oxide thickness as low as 0.8 nm, no significant flatband voltage shifts, and midgap d. of interface states values of 2 × 1012 cm-1 eV-1. AlN. Functional n-channel and p-channel Ge field effect transistors with nitride interlayer/high-κ oxide/metal gate stacks are demonstrated.
- 18Abdulagatov, A. I.; Ramazanov, S. M.; Dallaev, R. S.; Murliev, E. K.; Palchaev, D. K.; Rabadanov, M. K.; Abdulagatov, I. M. Atomic Layer Deposition of Aluminium Nitride Using Tris(Diethylamido)Aluminum and Hydrazine or Ammonia. Russ. Microelectron. 2018, 47, 118– 130, DOI: 10.1134/S1063739718020026Google Scholar18Atomic Layer Deposition of Aluminum Nitride Using Tris(diethylamido)aluminum and Hydrazine or AmmoniaAbdulagatov, A. I.; Ramazanov, Sh. M.; Dallaev, R. S.; Murliev, E. K.; Palchaev, D. K.; Rabadanov, M. Kh.; Abdulagatov, I. M.Russian Microelectronics (2018), 47 (2), 118-130CODEN: RUICE5; ISSN:1063-7397. (Pleiades Publishing, Ltd.)Aluminum nitride (AlNx) films were obtained by at. layer deposition (ALD) using tris(diethylamido) aluminum(III) (TDEAA) and hydrazine (N2H4) or ammonia (NH3). The quartz crystal microbalance (QCM) data showed that the surface reactions of TDEAA and N2H4 (or NH3) at temps. from 150 to 225°C were self-limiting. The rates of deposition of the nitride film at 200°C for systems with N2H4 and NH3 coincided: ∼1.1 Å/cycle. The ALD AlN films obtained at 200°C using hydrazine had higher d. (2.36 g/cm3, 72.4% of bulk d.) than those obtained with ammonia (2.22 g/cm3, 68%). The elemental anal. of the film deposited using TDEAA/N2H4 at 200°C showed the presence of carbon (∼1.4 at %), oxygen (∼3.2 at %), and hydrogen (22.6 at %) impurities. The N/Al at. concn. ratio was ∼1.3. The residual impurity content in the case of N2H4 was lower than for NH3. In general, it was confirmed that hydrazine has a more preferable surface thermochem. than ammonia.
- 19Abdulagatov, A. I.; Amashaev, R. R.; Ashurbekova, K. N.; Ashurbekova, K. N.; Rabadanov, M. K.; Abdulagatov, I. M. Atomic Layer Deposition of Aluminum Nitride and Oxynitride on Silicon Using Tris(Dimethylamido)Aluminum, Ammonia, and Water. Russ. J. Gen. Chem. 2018, 88, 1699– 1706, DOI: 10.1134/S1070363218080236Google Scholar19Atomic Layer Deposition of Aluminum Nitride and Oxynitride on Silicon Using Tris(dimethylamido)aluminum, Ammonia, and WaterAbdulagatov, A. I.; Amashaev, R. R.; Ashurbekova, Kr. N.; Ashurbekova, K. N.; Rabadanov, M. Kh.; Abdulagatov, I. M.Russian Journal of General Chemistry (2018), 88 (8), 1699-1706CODEN: RJGCEK; ISSN:1070-3632. (Pleiades Publishing, Ltd.)Thin films of aluminum nitride and oxynitride were deposited by at. layer deposition (ALD) in the temp. range from 170 to 290°C (optimal deposition temp. 200-230°C). Tris(dimethylamido) aluminum and ammonia were used as precursors for the at. layer deposition of aluminum nitride (AlN). The av. AlN film thickness per ALD cycle (deposition rate) at 200°C was ∼0.8 Å. Films were deposited on a silicon <100> substrate with a native oxide layer. The N/Al at. concn. ratio in the obtained films was ∼1.3. Aluminum oxynitride films obtained by periodical dose of water vapor in the course of at. layer deposition of AlN at 200°C. The compn. of the deposited oxynitride films was Al0.5O0.43N0.07.
- 20Gordon, R. G. Atomic Layer Deposition for Semiconductors. In Atomic Layer Deposition for Semiconductors; Hwang, C. S., Yoo, C. Y., Eds.; Springer US: New York, 2014; pp 15– 46.Google ScholarThere is no corresponding record for this reference.
- 21Kim, S. B.; Jayaraman, A.; Chua, D.; Davis, L. M.; Zheng, S. L.; Zhao, X.; Lee, S.; Gordon, R. G. Obtaining a Low and Wide Atomic Layer Deposition Window (150–275 °C) for In2O3 Films Using an InIII Amidinate and H2O. Chem. - Eur. J. 2018, 24, 9525– 9529, DOI: 10.1002/chem.201802317Google Scholar21Obtaining a low and wide atomic layer deposition window (150-275 °C) for In2O3 films using an InIII amidinate and H2OKim, Sang Bok; Jayaraman, Ashwin; Chua, Danny; Davis, Luke M.; Zheng, Shao-Liang; Zhao, Xizhu; Lee, Sunghwan; Gordon, Roy G.Chemistry - A European Journal (2018), 24 (38), 9525-9529CODEN: CEUJED; ISSN:0947-6539. (Wiley-VCH Verlag GmbH & Co. KGaA)Indium oxide is a major component of many technol. important thin films, most notably the transparent conductor indium tin oxide (ITO). Despite being pyrophoric, homoleptic indium(III) alkyls do not allow at. layer deposition (ALD) of In2O3 using water as a co-precursor at substrate temps. below 200 °C. Several alternative indium sources have been developed, but none allows ALD at lower temps. except in the presence of oxidants such as O2 or O3, which are not compatible with some substrates or alloying processes. We have synthesized a new indium precursor, tris(N,N'-diisopropylformamidinato)indium(III), compd. 1, which allows ALD of pure, carbon-free In2O3 films using H2O as the only co-reactant, on substrates in the temp. range 150-275 °C. In contrast, replacing just the H of the anionic iPrNC(H)NiPr ligand with a Me group (affording the known tris(N,N'-diisopropylacetamidinato)indium(III), compd. 2) results in a considerably higher and narrower ALD window in the analogous reaction with H2O (225-300 °C). Kinetic studies demonstrate that a higher rate of surface reactions in both parts of the ALD cycle gives rise to this difference in the ALD windows.
- 22Rouf, P.; O’Brien, N. J.; Rönnby, K.; Samii, R.; Ivanov, I. G.; Ojamaë, L.; Pedersen, H. The Endocyclic Carbon Substituent of Guanidinate and Amidinate Precursors Controlling Atomic Layer Deposition of InN Films. J. Phys. Chem. C 2019, 123, 25691– 25700, DOI: 10.1021/acs.jpcc.9b07005Google Scholar22The Endocyclic Carbon Substituent of Guanidinate and Amidinate Precursors Controlling Atomic Layer Deposition of InN FilmsRouf, Polla; O'Brien, Nathan J.; Roennby, Karl; Samii, Rouzbeh; Ivanov, Ivan G.; Ojamaee, Lars; Pedersen, HenrikJournal of Physical Chemistry C (2019), 123 (42), 25691-25700CODEN: JPCCCK; ISSN:1932-7447. (American Chemical Society)Indium nitride (InN) is an interesting material for future high-frequency electronics due to its high electron mobility. The problematic deposition of InN films currently prevents full exploration of InN-based electronics. We present studies of at. layer deposition (ALD) of InN using In precursors with bidentate ligands forming In-N bonds: tris(N,N-dimethyl-N',N''-diisopropylguanidinato)indium(III), tris(N,N'-diisopropylamidinato)indium(III), and tris(N,N'-diisopropylformamidinato)indium(III). These compds. form a series were the size of the substituent on the endocyclic position decreases from -NMe2 to -Me and to -H, resp. We show that when the size of the substituent decreases, the InN films deposited have a better cryst. quality, of better optical quality, lower roughness, and an In/N ratio closer to unity. From quantum chem. calcns., we show that the smaller substituents lead to less steric repulsion and weaker bonds between the ligand and In center. We propose that these effects render a more favored surface chem. for the nitridation step in the ALD cycle, which explains the improved film properties.
- 23Gebhard, M.; Hellwig, M.; Parala, H.; Xu, K.; Winter, M.; Devi, A. Indium-Tris-Guanidinates: A Promising Class of Precursors for Water Assisted Atomic Layer Deposition of In2O3 Thin Films. Dalt. Trans. 2014, 43, 937– 940, DOI: 10.1039/C3DT52746HGoogle Scholar23Indium-tris-guanidinates: a promising class of precursors for water assisted atomic layer deposition of In2O3 thin filmsGebhard, M.; Hellwig, M.; Parala, H.; Xu, K.; Winter, M.; Devi, A.Dalton Transactions (2014), 43 (3), 937-940CODEN: DTARAF; ISSN:1477-9226. (Royal Society of Chemistry)Two closely related mononuclear homoleptic In-tris-guanidinate complexes were synthesized and characterized as precursors for at. layer deposition (ALD) of In2O3. In a water-assisted ALD process, high quality In2O3 thin films were fabricated for the first time using the new class of precursors as revealed by the promising ALD growth characteristics and film properties.
- 24Barry, S. T.; Gordon, P. G.; Ward, M. J.; Heikkila, M. J.; Monillas, W. H.; Yap, G. P. A.; Ritala, M.; Leskelä, M. Chemical Vapour Deposition of In2O3 Thin Films from a Tris-Guanidinate Indium Precursor. Dalt. Trans. 2011, 40, 9425– 9430, DOI: 10.1039/c1dt10877hGoogle Scholar24Chemical vapour deposition of In2O3 thin films from a tris-guanidinate indium precursorBarry, Sean T.; Gordon, Peter G.; Ward, Matthew J.; Heikkila, Mikko J.; Monillas, Wesley H.; Yap, Glenn P. A.; Ritala, Mikko; Leskelae, MarkkuDalton Transactions (2011), 40 (37), 9425-9430CODEN: DTARAF; ISSN:1477-9226. (Royal Society of Chemistry)A new homoleptic sublimable indium(III) guanidinate, (In[(NiPr)2CNMe2]3) (I), was synthesized from a facile high-yield procedure. Compd. I crystd. is a P‾1 space group; a = 10.5989(14) Å, b = 11.0030(15) Å, c = 16.273(2) Å, α = 91.190(2)°, β = 96.561(2)°, γ = 115.555(2)°; R = 3.50%. Thermogravimetric anal. showed I to produce elemental indium as a residual mass. Thermolysis in a sealed NMR tube showed carbodiimide and protonated dimethylamine by 1H NMR. Chem. vapor deposition expts. at > 275°C with air as the reactant gas showed I to readily deposit cubic indium oxide with good transparency.
- 25Brazeau, A. L.; DiLabio, G. A.; Kreisel, K. A.; Monillas, W.; Yap, G. P. A.; Barry, S. T. Theoretical and Experimental Investigations of Ligand Exchange in Guanidinate Ligand Systems for Group 13 Metals. J. Chem. Soc. Dalt. Trans. 2007, (30), 3297– 3304, DOI: 10.1039/b706044kGoogle ScholarThere is no corresponding record for this reference.
- 26Kenney, A. P.; Yap, G. P. A.; Richeson, D. S.; Barry, S. T. The Insertion of Carbodiimides into Al and Ga Amido Linkages. Guanidinates and Mixed Amido Guanidinates of Aluminum and Gallium. Inorg. Chem. 2005, 44, 2926– 2933, DOI: 10.1021/ic048433gGoogle Scholar26The Insertion of Carbodiimides into Al and Ga Amido Linkages. Guanidinates and Mixed Amido Guanidinates of Aluminum and GalliumKenney, Amanda P.; Yap, Glenn P. A.; Richeson, Darrin S.; Barry, Sean T.Inorganic Chemistry (2005), 44 (8), 2926-2933CODEN: INOCAJ; ISSN:0020-1669. (American Chemical Society)The insertion of carbodiimides into existing metal-heteroatom bonds is an important preparative route for the synthesis of useful ligand systems such as amidinates and guanidinates. The authors' interest lies in multiple insertions at one metal center and the mechanisms of insertion and rearrangement. The authors synthesized and characterized [Me2NC(NiPr)2]nM(NMe2)3-n (n = 1, 2, 3; M = Al, Ga). The authors have studied the mechanism of synthesis and discovered a ligand transfer step that is important for the formation of the final products.
- 27Brazeau, A. L.; Wang, Z.; Rowley, C. N.; Barry, S. T. Synthesis and Thermolysis of Aluminum Amidinates: A Ligand-Exchange Route for New Mixed-Ligand Systems. Inorg. Chem. 2006, 45, 2276– 2281, DOI: 10.1021/ic051856dGoogle Scholar27Synthesis and Thermolysis of Aluminum Amidinates: A Ligand-Exchange Route for New Mixed-Ligand SystemsBrazeau, Allison L.; Wang, Zhaohui; Rowley, Chris N.; Barry, Sean T.Inorganic Chemistry (2006), 45 (5), 2276-2281CODEN: INOCAJ; ISSN:0020-1669. (American Chemical Society)A novel ligand-exchange route for the synthesis of amidinate-contg. compds. of aluminum is explored. Aluminum amidinates RC(NiPr)2AlR12 (4, 5; R = Me, R1 = Et; R = Et, R1 = Me) were prepd. starting from the corresponding carbodiimides, RLi and R12AlCl; guanidinate [Me2NC(NiPr)2]2AlH (6) was prepd. by redistribution reaction of the tris-guanidinate with AlH3·NMe2Et. The thermal reactivities of these compds. and their parent homoleptic compds. [MeC(NiPr)2]3Al (1), [Me2NC(NiPr)2]3Al (2), and [EtC(NiPr)2]3Al (3) were explored and analyzed with respect to their utility as potential at.-layer-deposition precursors for aluminum-contg. films. The major mechanism of thermal decompn. is found to be carbodiimide deinsertion to form aluminum alkyls or amides. Because of their thermal characteristics, both compds. 3 and 5 hold promise for use as precursors.
- 28Leman, J. T.; Barron, A. R. Synthesis of 1,3-Diphenyltriazenide Complexes of Aluminium, Gallium and Indium: Crystal Structure of Tris(1,3-Diphenyltriazenido)Aluminium(III). Polyhedron 1989, 8, 1909– 1912, DOI: 10.1016/S0277-5387(00)86413-XGoogle Scholar29Synthesis of 1,3-diphenyltriazenide complexes of aluminum, gallium and indium: crystal structure of tris(1,3-diphenyltriazenido)aluminum(III)Leman, John T.; Barron, Andrew R.; Ziller, Joseph W.; Kren, Robert M.Polyhedron (1989), 8 (15), 1909-12CODEN: PLYHDE; ISSN:0277-5387.The reaction of AlMe3 with 1,3-diphenyltriazene [Hdpt] in toluene gave Al(dpt)3, even when AlMe3 was in large excess. Monomeric Al(dpt)3 crystd. in space group C2/c with a 20.587(3), b 16.005(3), c 13.236(3) Å and β 119.172(12)°, Z 4, R 0.067 and Rw 0.083. The Al(III) is coordinated by 3 chelating triazenido ligands to give a trigonally distorted octahedral geometry. The Ga and In analogs are also reported.
- 29Leman, J. T.; Braddock-Wilking, J.; Coolong, A. J.; Barron, A. R. 1,3-Diaryltriazenido Compounds of Aluminum. Inorg. Chem. 1993, 32, 4324– 4336, DOI: 10.1021/ic00072a028Google Scholar301,3-Diaryltriazenido compounds of aluminumLeman, John T.; Braddock-Wilking, Janet; Coolong, Alanna J.; Barron, Andrew R.Inorganic Chemistry (1993), 32 (20), 4324-36CODEN: INOCAJ; ISSN:0020-1669.Reaction of AlH(iBu)2 with 1 and 2 equiv of 1,3-diphenyltriazene, PhN:NNHPh, yields [cyclic] Al(iBu)2[N(Ph)NN(Ph)] (1) and [cyclic] Al(iBu)[N(Ph)NN(Ph)]2 (2), resp. Compd. 2 undergoes ligand exchange in soln. to give an equimolar mixt. of 1 and [cyclic] Al[N(Ph)NN(Ph)]3. The reaction of Al(tBu)3 with PhN:NNHPh gives [cyclic] Al(tBu)2[N(Ph)NN(Ph)] (3) as the only product. Addn. of 1 equiv of PhN:NNHPh to AlMe2(BHT)(OEt2) (BHT-H = 2,6-di-tert-butyl-4-methylphenol) allows for the isolation of [cyclic] AlMe(BHT)[N(Ph)NN(Ph)] (4); however, a higher equiv of PhN:NNHPh yields only [cyclic] Al[N(Ph)NN(Ph)]3. The bis(triazenide) complex [cyclic] Al(BHT)[N(Ph)NN(Ph)]2 (5) is isolated from the reaction of PhN:NNHPh with AlH2(BHT)(NMe3), while [cyclic] Al(BHT)2[N(Ph)NN(Ph)] (6) is formed from the reaction of PhN:NNHPh with AlMe(BHT)2. Although the reaction of 1 with H2salen [N,N'-ethylenebis(salicylideneamine)] does not yield [cyclic] Al[N(Ph)NN(Ph)](salen) (8) but rather yields Al(iBu)(salen) (7), compd. 8 may be isolated from interaction of PhN:NNHPh with AlMe(salen). The reaction between AlMe3 and 3 equiv of substituted 1,3-diaryltriazenes, ArN:NNHAr, yields the 6-coordinate aluminum tris(1,3-diaryltriazenido) compds., [cyclic] Al[N(Ar)NN(Ar)]3 [Ar = 2-MeC6H4 (9), 4-MeC6H4 (10), 4-MeOC6H4 (11), 4-FC6H4 (12), 4-ClC6H4 (13), 4-BrC6H4 (14), C6F5 (15)]. The unsym. diaryltriazene complex [cyclic] Al[N(Ph)NN(4-MeOC6H4)]3 (16) adopts a trans-meridional conformation. The spectroscopic characterization of the tris(triazenido) complexes is discussed with respect to the nature of the aryl substituents. The X-ray structures of 1, 6, AlMe(salen), 9, 11, 13, (C6F5)N:NN(H)(C6F5), and (2-MeC6H4)N:NN(H)(2-MeC6H4).(2-MeC6H4)NH2 have been detd.
- 30O’Brien, N. J.; Rouf, P.; Samii, R.; Rönnby, K.; Buttera, S. C.; Hsu, C.-W.; Ivanov, I. G.; Kessler, V.; Ojamäe, L.; Pedersen, H. In-Situ Activation of an Indium(III) Triazenide Precursor for Epitaxial Indium Nitride by Atomic Layer Deposition. Chem. Mater. 2020, 32, 4481– 4489, DOI: 10.1021/acs.chemmater.9b05171Google Scholar31In Situ Activation of an Indium(III) Triazenide Precursor for Epitaxial Growth of Indium Nitride by Atomic Layer DepositionO'Brien, Nathan J.; Rouf, Polla; Samii, Rouzbeh; Roennby, Karl; Buttera, Sydney C.; Hsu, Chih-Wei; Ivanov, Ivan G.; Kessler, Vadim; Ojamaee, Lars; Pedersen, HenrikChemistry of Materials (2020), 32 (11), 4481-4489CODEN: CMATEX; ISSN:0897-4756. (American Chemical Society)Indium nitride (InN) is characterized by its high electron mobility, making it a ground-breaking material for high frequency electronics. The difficulty of depositing high-quality cryst. InN currently impedes its broad implementation in electronic devices. A new highly volatile In(III) triazenide precursor is reported, and its ability to deposit high-quality epitaxial hexagonal InN by at. layer deposition (ALD) is demonstrated. The new In(III) precursor, the 1st example of a homoleptic triazenide used in a vapor deposition process, was easily synthesized and purified by sublimation. TGA showed single step volatilization with an onset temp. of 145° and negligible residual mass. Two temp. intervals with self-limiting growth were obsd. when depositing InN films. In the high-temp. interval, the precursor underwent a gas-phase thermal decompn. inside the ALD reaction chamber to produce a more reactive In(III) compd. while retaining self-limiting growth behavior. D. functional theory calcns. revealed a unique 2-step decompn. process, which liberates 3 mols. of each propene and N2 to give a smaller tricoordinated In(III) species. Stoichiometric InN films with low levels of impurities were grown epitaxially on 4H-SiC. The InN films deposited at 325° had a sheet resistivity of 920 Ω/sq. This new triazenide precursor enables ALD of InN for semiconductor applications and provides a new family of M-N bonded precursors for future deposition processes. Crystallog. data are given.
- 31Rouf, P.; Samii, R.; Rönnby, K.; Bakhit, B.; Buttera, S. C.; Martinovic, I.; Ojamäe, L.; Hsu, C.-W.; Palisaitis, J.; Kessler, V.; Pedersen, H.; O’Brien, N. J. Hexacoordinated Gallium(III) Triazenide Precursor for Epitaxial Gallium Nitride by Atomic Layer Deposition. ChemRxiv 2020, DOI: 10.26434/chemrxiv.13190636.v1 .Google ScholarThere is no corresponding record for this reference.
- 32Bottaro, J. C.; Penwell, P. E.; Schmitt, R. J. Expedient Synthesis of T-Butyl Azide. Synth. Commun. 1997, 27, 1465– 1467, DOI: 10.1080/00397919708006078Google Scholar33Expedient synthesis of tert-butyl azideBottaro, Jeffrey C.; Penwell, Paul E.; Schmitt, Robert J.Synthetic Communications (1997), 27 (8), 1465-1467CODEN: SYNCAV; ISSN:0039-7911. (Dekker)A simple, economical synthesis of bulk (1-10,000 mol) amts. of Me3CN3 is described, using only Me3COH, H2O, NaN3 and H2SO4.
- 33Swetha, M.; Ramana, P. V.; Shirodkar, S. G. Simple and Efficient Method for the Synthesis of Azides in Water-THF Solvent System. Org. Prep. Proced. Int. 2011, 43, 348– 353, DOI: 10.1080/00304948.2011.594002Google Scholar34Simple and efficient method for the synthesis of azides in water-THF solvent systemSwetha, M.; Ramana, P. Venkata; Shirodkar, S. G.Organic Preparations and Procedures International (2011), 43 (4), 348-353CODEN: OPPIAK; ISSN:0030-4948. (Taylor & Francis Ltd.)The synthesis of azides under mild reaction conditions using a simple work-up was reported. Treatment of alkyl halides, mesylates, triflates, acetates, and tosylates with NaN3 in water-THF (95:5) at reflux yielded the corresponding alkyl azides. Addnl., arom. and aliph. acid chlorides were converted into acyl azides.
- 34Mayo, D. H.; Peng, Y.; Zavalij, P.; Bowen, K. H.; Eichhorn, B. W. Aluminium(III) Amidinates Formed from Reactions of “AlCl” with Lithium Amidinates. Acta Crystallogr., Sect. C: Cryst. Struct. Commun. 2013, 69, 1120– 1123, DOI: 10.1107/S0108270113023135Google Scholar35Aluminium(III) amidinates formed from reactions of AlCl with lithium amidinatesMayo, Dennis H.; Peng, Yang; Zavalij, Peter; Bowen, Kit H.; Eichhorn, Bryan W.Acta Crystallographica, Section C: Crystal Structure Communications (2013), 69 (10), 1120-1123CODEN: ACSCEE; ISSN:0108-2701. (International Union of Crystallography)The disproportionation of AlCl(THF)n (THF is tetrahydrofuran) in the presence of lithium amidinate species gives aluminum(III) amidinate complexes with partial or full chloride substitution. Three aluminum amidinate complexes formed during the reaction between aluminum monochloride and lithium amidinates are presented. The homoleptic complex tris(N,N'-diisopropylbenzimidamido)aluminum(III), [Al(C13H19N2)3] or Al{PhC[N(i-Pr)]2}3, (I), crystallizes from the same soln. as the heteroleptic complex chloridobis(N,N'-diisopropylbenzimidamido)aluminum(III), [Al(C13H19N2)2Cl] or Al{PhC[N(i-Pr)]2}2Cl, (II). Both have two crystallog. independent mols. per asym. unit (Z' = 2) and (I) shows disorder in four of its N(i-Pr) groups. Changing the ligand substituent to the bulkier cyclohexyl allows the isolation of the partial THF solvate chloridobis(N,N'-dicyclohexylbenzimidamido)aluminum(III) THF 0.675-solvate, [Al(C19H27N2)2Cl]·0.675C4H8O or Al[PhC(NCy)2]2Cl·0.675THF, (III). Despite having a twofold rotation axis running through its Al and Cl atoms, (III) has a similar mol. structure to that of (II).
- 35Springer Jr, C. S.; Sievers, R. E. Intramolecular Isomerization of Octahedral Complexes by Mechanisms Not Involving Bond Rupture. Inorg. Chem. 1967, 6, 852– 854, DOI: 10.1021/ic50050a049Google ScholarThere is no corresponding record for this reference.
- 36Rodger, A.; Johnson, B. F. Which Is More Likely: The Ray-Dutt Twist or the Bailar Twist?. Inorg. Chem. 1988, 27, 3061– 3062, DOI: 10.1021/ic00291a001Google Scholar37Which is more likely: the Ray-Dutt twist or the Bailar twist?Rodger, Alison; Johnson, Brian F. G.Inorganic Chemistry (1988), 27 (18), 3061-2CODEN: INOCAJ; ISSN:0020-1669.A recently developed model for detg. the relative stabilities of MLn systems is applied to the transition states of the non-bond breaking rearrangement mechanisms of tris chelate metal complexes. It is concluded that a complex with chelate bite much smaller than the distance between ligating atoms in the reactant proceeds via a Bailar twist mechanism, and that the Ray Dutt twist is favored under the opposite circumstances.
- 37Bryant, R. G. The NMR Time Scale. J. Chem. Educ. 1983, 60, 933– 935, DOI: 10.1021/ed060p933Google Scholar38The NMR time scaleBryant, Robert G.Journal of Chemical Education (1983), 60 (11), 933-5CODEN: JCEDA8; ISSN:0021-9584.Ambiguity in the NMR time-scale is discussed which can be extd. from different aspects of the spectrum. These include the relaxation rates assocd. with the lines, scalar coupling patterns, and resonance frequencies or chem. shifts.
- 38Kunte, G. V.; Shivashankar, S. A.; Umarji, A. M. Thermogravimetric Evaluation of the Suitability of Precursors for MOCVD. Meas. Sci. Technol. 2008, 19, 025704, DOI: 10.1088/0957-0233/19/2/025704Google Scholar39Thermogravimetric evaluation of the suitability of precursors for MOCVDKunte, G. V.; Shivashankar, S. A.; Umarji, A. M.Measurement Science and Technology (2008), 19 (2), 025704/1-025704/7CODEN: MSTCEP; ISSN:0957-0233. (Institute of Physics Publishing)A method based on the Langmuir equation for the estn. of vapor pressure and enthalpy of sublimation of subliming compds. is described. The variable temp. thermogravimetric/differential thermogravimetric (TG/DTG) curve of benzoic acid is used to arrive at the instrument parameters. Employing these parameters, the vapor pressure-temp. curves are derived for salicylic acid and camphor from their TG/DTG curves. The values match well with vapor pressure data in the literature, obtained by effusion methods. By employing the Clausius-Clapeyron equation, the enthalpy of sublimation could be calcd. Extending the method further, two precursors for metal-org. chem. vapor deposition (MOCVD) of titanium oxide, bis-iso-Pr bis tert-Bu 2-oxobutanoato titanium, Ti(OiPr)2(tbob)2, and bis-oxo-bis-tert-Bu 2-oxobutanoato titanium, [TiO(tbob)2]2, have been evaluated. The complex Ti(OiPr)2(tbob)2 is found to be a more suitable precursor. This approach can be helpful in quickly screening for the suitability of a compd. as a CVD precursor.
- 39Colominas, C.; Lau, K. H.; Hildenbrand, D. L.; Crouch-Baker, S.; Sanjurjo, A. Vapor Pressures of the Copper and Yttrium β-Diketonate MOCVD Precursors. J. Chem. Eng. Data 2001, 46, 446– 450, DOI: 10.1021/je0003445Google Scholar40Vapor Pressures of the Copper and Yttrium β-Diketonate MOCVD PrecursorsColominas, Carles; Lau, Kai H.; Hildenbrand, Donald L.; Crouch-Baker, Steven; Sanjurjo, AngelJournal of Chemical and Engineering Data (2001), 46 (2), 446-450CODEN: JCEAAX; ISSN:0021-9568. (American Chemical Society)The vapor pressures and vapor mol. wts. of the copper and yttrium β-diketonate MOCVD precursors Cu(C11H19O2)2(c) and Y(C11H19O2)3(c) were measured by a torsion-effusion/mass-loss method in the ranges (346 to 375) K and (361 to 387) K, resp. The mol. wt. data indicate that the satd. vapors of both precursors are highly monomeric. Vapor pressures, estd. to be accurate within 5%, are presented in equation form for reliable extrapolation to higher temps. The results are compared with other detns. in the literature.
- 40Frisch, M. J.; Trucks, G. W.; Schlegel, H. B.; Scuseria, G. E.; Robb, M. A.; Cheeseman, J. R.; Scalmani, G.; Barone, V.; Petersson, G. A.; Nakatsuji, H.; Li, X.; Caricato, M.; Marenich, A. V.; Bloino, J.; Janesko, B. G.; Gomperts, R.; Mennucci, B.; Hratchian, H. P.; Ortiz, J. V.; Izmaylov, A. F.; Sonnenberg, J. L.; Williams-Young, D.; Ding, F.; Lipparini, F.; Egidi, F.; Goings, J.; Peng, B.; Petrone, A.; Henderson, T.; Ranasinghe, D.; Zakrzewski, V. G.; Gao, J.; Rega, N.; Zheng, G.; Liang, W.; Hada, M.; Ehara, M.; Toyota, K.; Fukuda, R.; Hasegawa, J.; Ishida, M.; Nakajima, T.; Honda, Y.; Kitao, O.; Nakai, H.; Vreven, T.; Throssell, K.; Montgomery, J. A., Jr.; Peralta, J. E.; Ogliaro, F.; Bearpark, M.; Heyd, J. J.; Brothers, E. N.; Kudin, K. N.; Staroverov, V. N.; Kobayashi, R.; Normand, J.; Raghavachari, K.; Rendell, A.; Burant, J. C.; Iyengar, S. S.; Tomasi, J.; Cossi, M.; Millam, J. M.; Klene, M.; Adamo, C.; Cammi, R.; Ochterski, J. W.; Martin, R. L.; Morokuma, K.; Farkas, O.; Foresman, J. B.; Fox, D. J. Gaussian 16, revision B.01; Gaussian, Inc.: Wallingford CT, 2016.Google ScholarThere is no corresponding record for this reference.
- 41Hanson-Heine, M. W. D.; George, M. W.; Besley, N. A. Calculating Excited State Properties Using Kohn-Sham Density Functional Theory. J. Chem. Phys. 2013, 138, 064101, DOI: 10.1063/1.4789813Google Scholar42Calculating excited state properties using Kohn-Sham density functional theoryHanson-Heine, Magnus W. D.; George, Michael W.; Besley, Nicholas A.Journal of Chemical Physics (2013), 138 (6), 064101/1-064101/8CODEN: JCPSA6; ISSN:0021-9606. (American Institute of Physics)The accuracy of excited states calcd. with Kohn-Sham d. functional theory using the max. overlap method has been assessed for the calcn. of adiabatic excitation energies, excited state structures, and excited state harmonic and anharmonic vibrational frequencies for open-shell singlet excited states. The computed Kohn-Sham adiabatic excitation energies are improved significantly by post SCF spin-purifn., but remain too low compared with expt. with a larger error than time-dependent d. functional theory. Excited state structures and vibrational frequencies are also improved by spin-purifn. The structures show a comparable accuracy to time-dependent d. functional theory, while the harmonic vibrational frequencies are found to be more accurate for the majority of vibrational modes. The computed harmonic vibrational frequencies are also further improved by perturbative anharmonic corrections, suggesting a good description of the potential energy surface. Overall, excited state Kohn-Sham d. functional theory is shown to provide an efficient method for the calcn. of excited state structures and vibrational frequencies in open-shell singlet systems and provides a promising technique that can be applied to study large systems. (c) 2013 American Institute of Physics.
- 42Lecklider, T. Evaluation Engineering: Maintaining a Healthy Rhythm , 2011. https://www.evaluationengineering.com/home/article/13005576/maintaining-a-healthy-rhythm.Google ScholarThere is no corresponding record for this reference.
- 43Grimme, S.; Antony, J.; Ehrlich, S.; Krieg, H. A Consistent and Accurate Ab Initio Parametrization of Density Functional Dispersion Correction (DFT-D) for the 94 Elements H-Pu. J. Chem. Phys. 2010, 132, 154104, DOI: 10.1063/1.3382344Google Scholar44A consistent and accurate ab initio parametrization of density functional dispersion correction (DFT-D) for the 94 elements H-PuGrimme, Stefan; Antony, Jens; Ehrlich, Stephan; Krieg, HelgeJournal of Chemical Physics (2010), 132 (15), 154104/1-154104/19CODEN: JCPSA6; ISSN:0021-9606. (American Institute of Physics)The method of dispersion correction as an add-on to std. Kohn-Sham d. functional theory (DFT-D) has been refined regarding higher accuracy, broader range of applicability, and less empiricism. The main new ingredients are atom-pairwise specific dispersion coeffs. and cutoff radii that are both computed from first principles. The coeffs. for new eighth-order dispersion terms are computed using established recursion relations. System (geometry) dependent information is used for the first time in a DFT-D type approach by employing the new concept of fractional coordination nos. (CN). They are used to interpolate between dispersion coeffs. of atoms in different chem. environments. The method only requires adjustment of two global parameters for each d. functional, is asymptotically exact for a gas of weakly interacting neutral atoms, and easily allows the computation of at. forces. Three-body nonadditivity terms are considered. The method has been assessed on std. benchmark sets for inter- and intramol. noncovalent interactions with a particular emphasis on a consistent description of light and heavy element systems. The mean abs. deviations for the S22 benchmark set of noncovalent interactions for 11 std. d. functionals decrease by 15%-40% compared to the previous (already accurate) DFT-D version. Spectacular improvements are found for a tripeptide-folding model and all tested metallic systems. The rectification of the long-range behavior and the use of more accurate C6 coeffs. also lead to a much better description of large (infinite) systems as shown for graphene sheets and the adsorption of benzene on an Ag(111) surface. For graphene it is found that the inclusion of three-body terms substantially (by about 10%) weakens the interlayer binding. We propose the revised DFT-D method as a general tool for the computation of the dispersion energy in mols. and solids of any kind with DFT and related (low-cost) electronic structure methods for large systems. (c) 2010 American Institute of Physics.
- 44Weigend, F.; Ahlrichs, R. Balanced Basis Sets of Split Valence, Triple Zeta Valence and Quadruple Zeta Valence Quality for H to Rn: Design and Assessment of Accuracy. Phys. Chem. Chem. Phys. 2005, 7, 3297– 3305, DOI: 10.1039/b508541aGoogle Scholar45Balanced basis sets of split valence, triple zeta valence and quadruple zeta valence quality for H to Rn: Design and assessment of accuracyWeigend, Florian; Ahlrichs, ReinhartPhysical Chemistry Chemical Physics (2005), 7 (18), 3297-3305CODEN: PPCPFQ; ISSN:1463-9076. (Royal Society of Chemistry)Gaussian basis sets of quadruple zeta valence quality for Rb-Rn are presented, as well as bases of split valence and triple zeta valence quality for H-Rn. The latter were obtained by (partly) modifying bases developed previously. A large set of more than 300 mols. representing (nearly) all elements-except lanthanides-in their common oxidn. states was used to assess the quality of the bases all across the periodic table. Quantities investigated were atomization energies, dipole moments and structure parameters for Hartree-Fock, d. functional theory and correlated methods, for which we had chosen Moller-Plesset perturbation theory as an example. Finally recommendations are given which type of basis set is used best for a certain level of theory and a desired quality of results.
- 45Metz, B.; Stoll, H.; Dolg, M. Small-Core Multiconfiguration-Dirac-Hartree-Fock-Adjusted Pseudopotentials for Post-d Main Group Elements: Application to PhB and PbO. J. Chem. Phys. 2000, 113, 2563– 2569, DOI: 10.1063/1.1305880Google Scholar46Small-core multiconfiguration-Dirac-Hartree-Fock-adjusted pseudopotentials for post-d main group elements: Application to PbH and PbOMetz, Bernhard; Stoll, Hermann; Dolg, MichaelJournal of Chemical Physics (2000), 113 (7), 2563-2569CODEN: JCPSA6; ISSN:0021-9606. (American Institute of Physics)Relativistic pseudopotentials (PPs) of the energy-consistent variety have been generated for the post-d group 13-15 elements, by adjustment to multiconfiguration Dirac-Hartree-Fock data based on the Dirac-Coulomb-Breit Hamiltonian. The outer-core (n-1)spd shells are explicitly treated together with the nsp valence shell, with these PPs, and the implications of the small-core choice are discussed by comparison to a corresponding large-core PP, in the case of Pb. Results from valence ab initio one- and two-component calcns. using both PPs are presented for the fine-structure splitting of the ns2np2 ground-state configuration of the Pb atom, and for spectroscopic consts. of PbH (X 2Π1/2, 2Π3/2) and PbO (X 1Σ+). In addn., a combination of small-core and large-core PPs has been explored in spin-free-state shifted calcns. for the above mols.
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Abstract
Scheme 1
Scheme 1. Synthesis of Tris(1,3-dialkyltriazenide)aluminum(III) Compounds 1–6Figure 1
Figure 1. ORTEP drawing for one of two independent molecules in the unit cell of 6. Thermal ellipsoids are displayed at the 50% probability level, and hydrogen atoms are omitted for clarity.
Figure 2
Figure 2. (a) HOMO (−5.74 eV) and (b) LUMO (−0.78 eV) for 6 from DFT calculations.
Figure 3
Figure 3. Thermogravimetric analysis of 1–6.
Figure 4
Figure 4. The 1H NMR (500 MHz, C6D6) spectra from a decomposition study of 1 between 0.8–1.3 and 3.7–4.0 ppm separated by an axis break. For visibility, the y-axis is scaled up ∼18 times on the left of the axis break compared to the right side. Prior to flame sealing, the compound showed no traces of impurities by 1H NMR analysis. The peaks marked with an asterisk appeared after flame sealing the tube. Compound 1 was heated in C6D6, and all spectra were acquired at 50 °C to suppress line broadening. The decomposition of 1 accelerates after 210 °C, which is shown by the diminished quartet and doublet peaks.
Figure 5
Figure 5. Free energy profile (at 250 °C and 10 hPa) for the first half of the decomposition pathway. Here, 1 loses a triazene ligand (after TS-2), and one ligand decomposes into an imido ligand (TS-5). TS-3 has the largest free energy (211 kJmol–1) for the displayed part of the decomposition pathway. The overall largest free energy barrier is found at TS-8 (214 kJmol–1): the analogous step to TS-3 but for the last ligand. At 250 °C and 10 hPa, the adduct structures I-2A separate spontaneously (i.e., the process is barrierless and has a negative free energy difference) and is therefore not included.
Figure 6
Figure 6. Free energy profile continuing from I-5. The steps that transform I-5 into I-10 are analogous to the steps that transform 1 into I-5. The reverse step through TS-7 has a significantly larger free energy barrier compared to the analogous TS-2 (290 vs 85 kJ mol–1, respectively).
Scheme 2
Scheme 2. Separation of the Adduct Structure I-2A into a Triazene and I-2aaThe I-2 intermediate has one monoanionic N,N-coordinated and one dianionic C,N-coordinated triazenide ligand.
References
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- 3George, S. M. Atomic Layer Deposition: An Overview. Chem. Rev. 2010, 110, 111– 131, DOI: 10.1021/cr900056b3Atomic Layer Deposition: An OverviewGeorge, Steven M.Chemical Reviews (Washington, DC, United States) (2010), 110 (1), 111-131CODEN: CHREAY; ISSN:0009-2665. (American Chemical Society)A review. A review on the at. layer deposition and its application to the fabrication of semiconductor device and nanodevices. The nucleation and growth mechanism during at. layer deposition are discussed.
- 4Koponen, S. E.; Gordon, P. G.; Barry, S. T. Principles of Precursor Design for Vapour Deposition Methods. Polyhedron 2016, 108, 59– 66, DOI: 10.1016/j.poly.2015.08.0244Principles of precursor design for vapour deposition methodsKoponen, Sara E.; Gordon, Peter G.; Barry, Sean T.Polyhedron (2016), 108 (), 59-66CODEN: PLYHDE; ISSN:0277-5387. (Elsevier Ltd.)A review. CVD and at. layer deposition (ALD) are attractive techniques for depositing a wide spectrum of thin solid film materials, for a broad spectrum of industrial applications. These techniques rely on volatile, reactive, and thermally stable mol. precursors to transport and deposit growth materials in a kinetically controlled manner, resulting in uniform, conformal, high purity films. Developments in these fields depend on careful precursor design. The qualities that make successful CVD or ALD precursors (low m.p., high volatility, stability and specific reactivity) and the widely applicable design principles used to achieve them, through examples of Group 11 and 13 precursors including amidinates, guanidinates and iminopyrrolidinates are discussed. The authors highlight the most valuable techniques that the authors use to asses potential precursors from the discussed qualities, and to elucidate relevant mechanisms of decompn. and surface reactivity. There is a strong focus on TGA, and solid state (SS) and soln. NMR studies.
- 5Van Bui, H.; Nguyen, M. D.; Wiggers, F. B.; Aarnink, A. A. I.; De Jong, M. P.; Kovalgin, A. Y. Self-Limiting Growth and Thickness- And Temperature- Dependence of Optical Constants of ALD AlN Thin Films. ECS J. Solid State Sci. Technol. 2014, 3, P101– P106, DOI: 10.1149/2.020404jss5Self-limiting growth and thickness- and temperature-dependence of optical constants of ALD AlN thin filmsVan Bui, H.; Nguyen, M. D.; Wiggers, F. B.; Aarnink, A. A. I.; de Jong, M. P.; Kovalgin, A. Y.ECS Journal of Solid State Science and Technology (2014), 3 (4), P101-P106CODEN: EJSSBG; ISSN:2162-8769. (Electrochemical Society)We have investigated the growth characteristics and optical consts. of thin AlN films made by thermal at. layer deposition (ALD) from AlMe3 and NH3. We obsd. the nucleation, closure and growth after closure of the films using AFM and in-situ spectroscopic ellipsometry. A fully covered surface was obtained for films with a thickness of about 2 nm. The self-limiting ALD growth was obsd. at temps. of 330 and 350° with deposition rates of 1.5 and 2.1 Å/cycle, resp. At 370°, thermal decompn. of TMA dominated the growth mechanism, resulting in a fast and non-self-limiting deposition. Low concns. of O (0.8-2.5%) and C (5-7.5%) incorporated into the films were measured. We found that the refractive index increased remarkably with increasing film thickness and growth temp.
- 6Riihelä, D.; Ritala, M.; Matero, R.; Leskelä, M.; Jokinen, J.; Haussalo, P. Low Temperature Deposition of AlN Films by an Alternate Supply of Trimethyl Aluminum and Ammonia. Chem. Vap. Deposition 1996, 2, 277– 283, DOI: 10.1002/cvde.19960020612There is no corresponding record for this reference.
- 7Liu, X.; Ramanathan, S.; Lee, E.; Seidel, T. E. Atomic Layer Deposition of Aluminum Nitride Thin Films from Trimethyl Aluminum (TMA) and Ammonia. MRS Online Proceedings Library 2003, 811, 158– 153, DOI: 10.1557/PROC-811-D1.9There is no corresponding record for this reference.
- 8Jung, Y. C.; Hwang, S. M.; Le, D. N.; Kondusamy, A. L. N.; Mohan, J.; Kim, S. W.; Kim, J. H.; Lucero, A. T.; Ravichandran, A.; Kim, H. S.; Kim, S. J.; Choi, R.; Ahn, J.; Alvarez, D.; Spiegelman, J.; Kim, J. Low Temperature Thermal Atomic Layer Deposition of Aluminum Nitride Using Hydrazine as the Nitrogen Source. Materials 2020, 13, 3387, DOI: 10.3390/ma131533878Low temperature thermal atomic layer deposition of aluminum nitride using hydrazine as the nitrogen sourceJung, Yong Chan; Hwang, Su Min; Le, Dan N.; Kondusamy, Aswin L. N.; Mohan, Jaidah; Kim, Sang Woo; Kim, Jin Hyun; Lucero, Antonio T.; Ravichandran, Arul; Kim, Harrison Sejoon; Kim, Si Joon; Choi, Rino; Ahn, Jinho; Alvarez, Daniel; Spiegelman, Jeff; Kim, JiyoungMaterials (2020), 13 (15), 3387CODEN: MATEG9; ISSN:1996-1944. (MDPI AG)Aluminum nitride (AlN) thin films were grown using thermal at. layer deposition in the temp. range of 175-350 °C. The thin films were deposited using tri-Me aluminum (TMA) and hydrazine (N2H4) as a metal precursor and nitrogen source, resp. Highly reactive N2H4, compared to its conventionally used counterpart, ammonia (NH3), provides a higher growth per cycle (GPC), which is approx. 2.3 times higher at a deposition temp. of 300 °C and, also exhibits a low impurity concn. in as-deposited films. Low temp. AlN films deposited at 225 °C with a capping layer had an Al to N compn. ratio of 1:1.1, a close to ideal compn. ratio, with a low oxygen content (7.5%) while exhibiting a GPC of 0.16 nm/cycle. We suggest that N2H4 as a replacement for NH3 is a good alternative due to its stringent thermal budget.
- 9Dendooven, J.; Deduytsche, D.; Musschoot, J.; Vanmeirhaeghe, R. L.; Detavernier, C. Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition. J. Electrochem. Soc. 2010, 157, G111, DOI: 10.1149/1.33016649Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer DepositionDendooven, J.; Deduytsche, D.; Musschoot, J.; Vanmeirhaeghe, R. L.; Detavernier, C.Journal of the Electrochemical Society (2010), 157 (4), G111-G116CODEN: JESOAN; ISSN:0013-4651. (Electrochemical Society)This paper focuses on the conformality of the plasma-enhanced at. layer deposition (PE-ALD) of Al2O3 using trimethylaluminum [AlMe3; (TMA)] as a precursor and O2 plasma as an oxidant source. The conformality was quantified by measuring the deposited film thickness as a function of depth into macroscopic test structures with aspect ratios of ∼5, 10, and 22. A comparison with the thermal TMA/H2O process indicates that the conformality of the plasma based process is more limited due to the surface recombination of radicals during the plasma step. The conformality can slightly be improved by raising the gas pressure or the radiofrequency power. Prolonging the plasma exposure time results in further improvement of the conformality. Also, there are indications that the H2O produced during the plasma step in the PE-ALD process for Al2O3 contributes to the obsd. conformality through a secondary thermal ALD reaction. The conformality of Al2O3 is also compared to the conformality of AlN deposited by PE-ALD from TMA and NH3 plasma. For the same exposure, O2 plasma results in better conformality compared to NH3 plasma, suggesting a faster recombination of the radicals in the NH3 plasma.
- 10Ozgit, C.; Donmez, I.; Alevli, M.; Biyikli, N. Self-Limiting Low-Temperature Growth of Crystalline AlN Thin Films by Plasma-Enhanced Atomic Layer Deposition. Thin Solid Films 2012, 520, 2750– 2755, DOI: 10.1016/j.tsf.2011.11.08110Self-limiting low-temperature growth of crystalline AlN thin films by plasma-enhanced atomic layer depositionOzgit, Cagla; Donmez, Inci; Alevli, Mustafa; Biyikli, NecmiThin Solid Films (2012), 520 (7), 2750-2755CODEN: THSFAP; ISSN:0040-6090. (Elsevier B.V.)We report on the self-limiting growth and characterization of AlN thin films. AlN films were deposited by plasma-enhanced at. layer deposition on various substrates using AlMe3 and NH3. At 185°, deposition rate satd. for AlMe3 and NH3 doses starting from 0.05 and 40 s, resp. Saturative surface reactions between AlMe3 and NH3 resulted in a const. growth rate of ≈0.86 Å/cycle from 100-200°. Within this temp. range, film thickness increased linearly with the no. of deposition cycles. At higher temps. (≥225°) deposition rate increased with temp. Chem. compn. and bonding states of the films deposited at 185° were investigated by XPS. High resoln. Al 2p and N 1s spectra confirmed the presence of AlN with peaks located at 73.02 and 396.07 eV, resp. Films deposited at 185° were polycryst. with a hexagonal wurtzite structure regardless of the substrate selection as detd. by grazing incidence x-ray diffraction. High-resoln. TEM images of the AlN thin films deposited on Si (100) and glass substrates revealed a microstructure consisting of nanometer sized crystallites. Films exhibited an optical band edge at ≈ 5.8 eV and an optical transmittance of >95% in the visible region of the spectrum.
- 11Ozgit-Akgun, C.; Goldenberg, E.; Okyay, A. K.; Biyikil, N. Hollow Cathode Plasma-Assisted Atomic Layer Deposition of Crystalline AlN, GaN and AlxGa1-XN Thin Films at Low Temperatures. J. Mater. Chem. C 2014, 2, 2123– 2136, DOI: 10.1039/C3TC32418D11Hollow cathode plasma-assisted atomic layer deposition of crystalline AlN, GaN and AlxGa1-xN thin films at low temperaturesOzgit-Akgun, Cagla; Goldenberg, Eda; Okyay, Ali Kemal; Biyikli, NecmiJournal of Materials Chemistry C: Materials for Optical and Electronic Devices (2014), 2 (12), 2123-2136CODEN: JMCCCX; ISSN:2050-7534. (Royal Society of Chemistry)The authors report on the use of hollow cathode plasma for low-temp. plasma-assisted at. layer deposition (PA-ALD) of cryst. AlN, GaN and AlxGa1-xN thin films with low impurity concns. Depositions were carried out at 200° using trimethylmetal precursors and NH3 or N2/H2 plasma. XPS showed 2.5-3 at. % O in AlN and 1.5-1.7 at. % O in GaN films deposited using NH3 and N2/H2 plasma, resp. No C impurities were detected within the films. Secondary ion mass spectroscopy analyses performed on the films deposited using NH3 plasma revealed O, C (both <1 at.%), and H impurities. GIXRD patterns indicated polycryst. thin films with wurtzite crystal structure. Hollow cathode PA-ALD parameters were optimized for AlN and GaN thin films using N2/H2 plasma. Trimethylmetal and N2/H2 satn. curves evidenced the self-limiting growth of AlN and GaN at 200°. AlN exhibited linear growth with a growth per cycle (GPC) of ∼1.0 Å. For GaN, the GPC decreased with the increasing no. of deposition cycles, indicating substrate-enhanced growth. The GPC calcd. from a 900-cycle GaN deposition was 0.22 Å. Ellipsometric spectra of the samples were modeled using the Cauchy dispersion function, from which the refractive indexes of 59.2 nm thick AlN and 20.1 nm thick GaN thin films are 1.94 and 2.17 at 632 nm, resp. Spectral transmission measurements of AlN, GaN and AlxGa1-xN thin films grown on double side polished sapphire substrates revealed near-ideal visible transparency with minimal absorption. Optical band edge values of the AlxGa1-xN films shifted to lower wavelengths with the increasing Al content, indicating the tunability of band edge values with the alloy compn.
- 12Bosund, M.; Sajavaara, T.; Laitinen, M.; Huhtio, T.; Putkonen, M.; Airaksinen, V. M.; Lipsanen, H. Properties of AlN Grown by Plasma Enhanced Atomic Layer Deposition. Appl. Surf. Sci. 2011, 257, 7827– 7830, DOI: 10.1016/j.apsusc.2011.04.03712Properties of AlN grown by plasma enhanced atomic layer depositionBosund, Markus; Sajavaara, Timo; Laitinen, Mikko; Huhtio, Teppo; Putkonen, Matti; Airaksinen, Veli-Matti; Lipsanen, HarriApplied Surface Science (2011), 257 (17), 7827-7830CODEN: ASUSEE; ISSN:0169-4332. (Elsevier B.V.)The influence of growth parameters on the properties of AlN films fabricated by plasma-enhanced at. layer deposition using AlEt3 and NH3 precursors was investigated. The at. concns., refractive index, mass d., crystallinity, and surface roughness were studied from the films grown in the temp. range of 100-300° with plasma discharge times between 2.5-30 s. The AlN films were shown to be H-rich having H concns. in the range of 13-27 at.% with inverse dependence on the growth temp. The C and O concns. in the films were <2.6% and 0.2%, resp. The refractive index and mass d. of the films correlated with the H concn. so that higher concns. (lower growth temps.) resulted in smaller refractive index and mass d. The film grown at 300° was found to be cryst. whereas lower growth temp. produced amorphous films.
- 13Nepal, N.; Qadri, S. B.; Hite, J. K.; Mahadik, N. A.; Mastro, M. A.; Eddy, C. R. Epitaxial Growth of {AlN} Films via Plasma-Assisted Atomic Layer Epitaxy. Appl. Phys. Lett. 2013, 103, 82110, DOI: 10.1063/1.481879213Epitaxial growth of AlN films via plasma-assisted atomic layer epitaxyNepal, N.; Qadri, S. B.; Hite, J. K.; Mahadik, N. A.; Mastro, M. A.; Eddy, C. R., Jr.Applied Physics Letters (2013), 103 (8), 082110/1-082110/5CODEN: APPLAB; ISSN:0003-6951. (American Institute of Physics)Thin AlN layers were grown at 200-650 °C by plasma assisted at. layer epitaxy (PA-ALE) simultaneously on Si(111), sapphire (11-20), and GaN/sapphire substrates. The AlN growth on Si(111) is self-limited for trimethyaluminum (TMA) pulse of length > 0.04 s, using a 10 s purge. However, the AlN nucleation on GaN/sapphire is non-uniform and has a bimodal island size distribution for TMA pulse of ≤0.03 s. The growth rate (GR) remains almost const. for Tg between 300 and 400 °C indicating ALE mode at those temps. The GR is increased by 20% at Tg = 500 °C. Spectroscopic ellipsometry (SE) measurement shows that the ALE AlN layers grown at Tg ≤ 400 °C have no clear band edge related features, however, the theor. estd. band gap of 6.2 eV was measured for AlN grown at Tg ≥ 500 °C. X-ray diffraction measurements on 37 nm thick AlN films grown at optimized growth conditions (Tg = 500 °C, 10 s purge, 0.06 s TMA pulse) reveal that the ALE AlN on GaN/sapphire is (0002) oriented with rocking curve full width at the half max. (FWHM) of 670 arc sec. Epitaxial growth of cryst. AlN layers by PA-ALE at low temps. broadens application of the material in the technologies that require large area conformal growth at low temps. with thickness control at the at. scale. (c) 2013 American Institute of Physics.
- 14Waggoner, K. M.; Olmstead, M. M.; Power, P. P. Structural and Spectroscopic Characterization of the Compounds [Al(NMe2)3]2, [Ga(NMe2)3]2, [(Me2N)2Al{μ-N(H)1-Ad}]2 (1-Ad = 1-Adamantanyl) and [{Me(μ-NPh2)Al}2NPh(μ-C6H4)]. Polyhedron 1990, 9, 257– 263, DOI: 10.1016/S0277-5387(00)80578-114Structural and spectroscopic characterization of the compounds [Al(NMe2)3]2, [Ga(NMe2)3]2, [(Me2N)2Al{μ-N(H)1-Ad}]2 (1-Ad = 1-adamantanyl) and [{Me(μ-NPh2)Al}2NPh(μ-C6H4)]Waggoner, K. M.; Olmstead, M. M.; Power, P. P.Polyhedron (1990), 9 (2-3), 257-63CODEN: PLYHDE; ISSN:0277-5387.[Al(NMe2)3]2 (I), [Ga(NMe2)3]2 (II), [(Me2N)2Al{μ-1-AdNH}]2 (III; 1-AdNH2 = adamantanylamine) and [{Me(μ-NPh2)Al}2NPh(μ-C6H4)].0.5PhMe (IV) were prepd. and structurally and spectroscopically characterized by x-ray crystallog., 1H, 13C, 27Al, 69Ga and 71Ga NMR. A new synthesis is also provided for the previously known compd. I. The structures of I and II are the 1st reported structures of tris-dialkylamides of Al or Ga. Both possess dimeric structures in the solid with dimethylamide bridges and distorted tetrahedral geometry at the metal. The terminal NMe2 groups display significant deviation from planarity in both compds. The transamination reaction between I and 1 equiv of 1-AdNH2 affords III in high yield. IV was prepd. by treatment of AlMe3 with 2 equiv of HNPh2 in refluxing toluene and is somewhat surprising in view of the prior synthesis of Al(NPh2)3 via a similar reaction. I and II are triclinic, space group P‾1, R = 0.041 and 0.035, resp.; III and IV are monoclinic, space group P21/c, R = 0.047 and 0.066, resp.
- 15Wade, C. R.; Silvernail, C.; Banerjee, C.; Soulet, A.; McAndrew, J.; Belot, J. A. Tris(Dialkylamino)Aluminums: Syntheses, Characterization, Volatility Comparison and Atomic Layer Deposition of Alumina Thin Films. Mater. Lett. 2007, 61, 5079– 5082, DOI: 10.1016/j.matlet.2007.04.00915Tris(dialkylamino)aluminums: Syntheses, characterization, volatility comparison and atomic layer deposition of alumina thin filmsWade, Casey R.; Silvernail, Carter; Banerjee, Chiranjib; Soulet, Axel; McAndrew, James; Belot, John A.Materials Letters (2007), 61 (29), 5079-5082CODEN: MLETDJ; ISSN:0167-577X. (Elsevier B.V.)The syntheses and characterization of both tris(diethylamino)aluminum and tris(diisopropylamino)aluminum are presented. Characterization includes vapor pressure measurements and comparison of the 2 non-pyrophoric precursors showing them to be viable alternatives to trimethylaluminum. Tris(diisopropyl)aluminum was successful in the at. layer deposition of alumina thin films.
- 16Liu, G.; Deguns, E.; Lecordier, L.; Sundaram, G.; Becker, J. Atomic Layer Deposition of AlN with Tris(Dimethylamido)Aluminum and NH. ECS Trans. 2011, 41, 219– 225, DOI: 10.1149/1.363367116Atomic layer deposition of AlN with tris(dimethylamido)aluminum and NH3Liu, G.; Deguns, E. W.; Lecordier, L.; Sundaram, G.; Becker, J. S.ECS Transactions (2011), 41 (2, Atomic Layer Deposition Applications 7), 219-225CODEN: ECSTF8; ISSN:1938-5862. (Electrochemical Society)Atomic layer deposition of aluminum nitride on Si wafers using tris(dimethylamido)aluminum and ammonia has been investigated in the temp. range from 180 to 400°C. Satd. growth behavior not obsd. with NH3 pulsed in continuous mode has been achieved in NH3 exposure mode. Thin AlN films have been analyzed by spectroscopic ellipsometry and SIMS for optical and chem. properties, X-ray diffraction for crystallinity, and mercury probe for elec. properties. Polycryst. and high purity AlN films have been obtained at 300°C or higher. A high dielec. const. in the range of 7.4-7.7 and high breakdown field of 5.3-5.6 MV/cm with relatively low leakage current in the 10-7 to 10-8 A/cm2 range at 2MV/cm have been obtained for AlN films deposited between 300 and 400°C in NH3 exposure mode.
- 17Kim, K. H.; Gordon, R. G.; Ritenour, A.; Antoniadis, D. A. Atomic Layer Deposition of Insulating Nitride Interfacial Layers for Germanium Metal Oxide Semiconductor Field Effect Transistors with High-κ Oxide/Tungsten Nitride Gate Stacks. Appl. Phys. Lett. 2007, 90, 212104, DOI: 10.1063/1.274160917Atomic layer deposition of insulating nitride interfacial layers for germanium metal oxide semiconductor field effect transistors with high-κ oxide/tungsten nitride gate stacksKim, Kyoung H.; Gordon, Roy G.; Ritenour, Andrew; Antoniadis, Dimitri A.Applied Physics Letters (2007), 90 (21), 212104/1-212104/3CODEN: APPLAB; ISSN:0003-6951. (American Institute of Physics)At. layer deposition (ALD) was used to deposit passivating interfacial nitride layers between Ge and high-κ oxides. High-κ oxides on Ge surfaces passivated by ultrathin (1-2 nm) ALD Hf3N4 or AlN layers exhibited well-behaved C-V characteristics with an equiv. oxide thickness as low as 0.8 nm, no significant flatband voltage shifts, and midgap d. of interface states values of 2 × 1012 cm-1 eV-1. AlN. Functional n-channel and p-channel Ge field effect transistors with nitride interlayer/high-κ oxide/metal gate stacks are demonstrated.
- 18Abdulagatov, A. I.; Ramazanov, S. M.; Dallaev, R. S.; Murliev, E. K.; Palchaev, D. K.; Rabadanov, M. K.; Abdulagatov, I. M. Atomic Layer Deposition of Aluminium Nitride Using Tris(Diethylamido)Aluminum and Hydrazine or Ammonia. Russ. Microelectron. 2018, 47, 118– 130, DOI: 10.1134/S106373971802002618Atomic Layer Deposition of Aluminum Nitride Using Tris(diethylamido)aluminum and Hydrazine or AmmoniaAbdulagatov, A. I.; Ramazanov, Sh. M.; Dallaev, R. S.; Murliev, E. K.; Palchaev, D. K.; Rabadanov, M. Kh.; Abdulagatov, I. M.Russian Microelectronics (2018), 47 (2), 118-130CODEN: RUICE5; ISSN:1063-7397. (Pleiades Publishing, Ltd.)Aluminum nitride (AlNx) films were obtained by at. layer deposition (ALD) using tris(diethylamido) aluminum(III) (TDEAA) and hydrazine (N2H4) or ammonia (NH3). The quartz crystal microbalance (QCM) data showed that the surface reactions of TDEAA and N2H4 (or NH3) at temps. from 150 to 225°C were self-limiting. The rates of deposition of the nitride film at 200°C for systems with N2H4 and NH3 coincided: ∼1.1 Å/cycle. The ALD AlN films obtained at 200°C using hydrazine had higher d. (2.36 g/cm3, 72.4% of bulk d.) than those obtained with ammonia (2.22 g/cm3, 68%). The elemental anal. of the film deposited using TDEAA/N2H4 at 200°C showed the presence of carbon (∼1.4 at %), oxygen (∼3.2 at %), and hydrogen (22.6 at %) impurities. The N/Al at. concn. ratio was ∼1.3. The residual impurity content in the case of N2H4 was lower than for NH3. In general, it was confirmed that hydrazine has a more preferable surface thermochem. than ammonia.
- 19Abdulagatov, A. I.; Amashaev, R. R.; Ashurbekova, K. N.; Ashurbekova, K. N.; Rabadanov, M. K.; Abdulagatov, I. M. Atomic Layer Deposition of Aluminum Nitride and Oxynitride on Silicon Using Tris(Dimethylamido)Aluminum, Ammonia, and Water. Russ. J. Gen. Chem. 2018, 88, 1699– 1706, DOI: 10.1134/S107036321808023619Atomic Layer Deposition of Aluminum Nitride and Oxynitride on Silicon Using Tris(dimethylamido)aluminum, Ammonia, and WaterAbdulagatov, A. I.; Amashaev, R. R.; Ashurbekova, Kr. N.; Ashurbekova, K. N.; Rabadanov, M. Kh.; Abdulagatov, I. M.Russian Journal of General Chemistry (2018), 88 (8), 1699-1706CODEN: RJGCEK; ISSN:1070-3632. (Pleiades Publishing, Ltd.)Thin films of aluminum nitride and oxynitride were deposited by at. layer deposition (ALD) in the temp. range from 170 to 290°C (optimal deposition temp. 200-230°C). Tris(dimethylamido) aluminum and ammonia were used as precursors for the at. layer deposition of aluminum nitride (AlN). The av. AlN film thickness per ALD cycle (deposition rate) at 200°C was ∼0.8 Å. Films were deposited on a silicon <100> substrate with a native oxide layer. The N/Al at. concn. ratio in the obtained films was ∼1.3. Aluminum oxynitride films obtained by periodical dose of water vapor in the course of at. layer deposition of AlN at 200°C. The compn. of the deposited oxynitride films was Al0.5O0.43N0.07.
- 20Gordon, R. G. Atomic Layer Deposition for Semiconductors. In Atomic Layer Deposition for Semiconductors; Hwang, C. S., Yoo, C. Y., Eds.; Springer US: New York, 2014; pp 15– 46.There is no corresponding record for this reference.
- 21Kim, S. B.; Jayaraman, A.; Chua, D.; Davis, L. M.; Zheng, S. L.; Zhao, X.; Lee, S.; Gordon, R. G. Obtaining a Low and Wide Atomic Layer Deposition Window (150–275 °C) for In2O3 Films Using an InIII Amidinate and H2O. Chem. - Eur. J. 2018, 24, 9525– 9529, DOI: 10.1002/chem.20180231721Obtaining a low and wide atomic layer deposition window (150-275 °C) for In2O3 films using an InIII amidinate and H2OKim, Sang Bok; Jayaraman, Ashwin; Chua, Danny; Davis, Luke M.; Zheng, Shao-Liang; Zhao, Xizhu; Lee, Sunghwan; Gordon, Roy G.Chemistry - A European Journal (2018), 24 (38), 9525-9529CODEN: CEUJED; ISSN:0947-6539. (Wiley-VCH Verlag GmbH & Co. KGaA)Indium oxide is a major component of many technol. important thin films, most notably the transparent conductor indium tin oxide (ITO). Despite being pyrophoric, homoleptic indium(III) alkyls do not allow at. layer deposition (ALD) of In2O3 using water as a co-precursor at substrate temps. below 200 °C. Several alternative indium sources have been developed, but none allows ALD at lower temps. except in the presence of oxidants such as O2 or O3, which are not compatible with some substrates or alloying processes. We have synthesized a new indium precursor, tris(N,N'-diisopropylformamidinato)indium(III), compd. 1, which allows ALD of pure, carbon-free In2O3 films using H2O as the only co-reactant, on substrates in the temp. range 150-275 °C. In contrast, replacing just the H of the anionic iPrNC(H)NiPr ligand with a Me group (affording the known tris(N,N'-diisopropylacetamidinato)indium(III), compd. 2) results in a considerably higher and narrower ALD window in the analogous reaction with H2O (225-300 °C). Kinetic studies demonstrate that a higher rate of surface reactions in both parts of the ALD cycle gives rise to this difference in the ALD windows.
- 22Rouf, P.; O’Brien, N. J.; Rönnby, K.; Samii, R.; Ivanov, I. G.; Ojamaë, L.; Pedersen, H. The Endocyclic Carbon Substituent of Guanidinate and Amidinate Precursors Controlling Atomic Layer Deposition of InN Films. J. Phys. Chem. C 2019, 123, 25691– 25700, DOI: 10.1021/acs.jpcc.9b0700522The Endocyclic Carbon Substituent of Guanidinate and Amidinate Precursors Controlling Atomic Layer Deposition of InN FilmsRouf, Polla; O'Brien, Nathan J.; Roennby, Karl; Samii, Rouzbeh; Ivanov, Ivan G.; Ojamaee, Lars; Pedersen, HenrikJournal of Physical Chemistry C (2019), 123 (42), 25691-25700CODEN: JPCCCK; ISSN:1932-7447. (American Chemical Society)Indium nitride (InN) is an interesting material for future high-frequency electronics due to its high electron mobility. The problematic deposition of InN films currently prevents full exploration of InN-based electronics. We present studies of at. layer deposition (ALD) of InN using In precursors with bidentate ligands forming In-N bonds: tris(N,N-dimethyl-N',N''-diisopropylguanidinato)indium(III), tris(N,N'-diisopropylamidinato)indium(III), and tris(N,N'-diisopropylformamidinato)indium(III). These compds. form a series were the size of the substituent on the endocyclic position decreases from -NMe2 to -Me and to -H, resp. We show that when the size of the substituent decreases, the InN films deposited have a better cryst. quality, of better optical quality, lower roughness, and an In/N ratio closer to unity. From quantum chem. calcns., we show that the smaller substituents lead to less steric repulsion and weaker bonds between the ligand and In center. We propose that these effects render a more favored surface chem. for the nitridation step in the ALD cycle, which explains the improved film properties.
- 23Gebhard, M.; Hellwig, M.; Parala, H.; Xu, K.; Winter, M.; Devi, A. Indium-Tris-Guanidinates: A Promising Class of Precursors for Water Assisted Atomic Layer Deposition of In2O3 Thin Films. Dalt. Trans. 2014, 43, 937– 940, DOI: 10.1039/C3DT52746H23Indium-tris-guanidinates: a promising class of precursors for water assisted atomic layer deposition of In2O3 thin filmsGebhard, M.; Hellwig, M.; Parala, H.; Xu, K.; Winter, M.; Devi, A.Dalton Transactions (2014), 43 (3), 937-940CODEN: DTARAF; ISSN:1477-9226. (Royal Society of Chemistry)Two closely related mononuclear homoleptic In-tris-guanidinate complexes were synthesized and characterized as precursors for at. layer deposition (ALD) of In2O3. In a water-assisted ALD process, high quality In2O3 thin films were fabricated for the first time using the new class of precursors as revealed by the promising ALD growth characteristics and film properties.
- 24Barry, S. T.; Gordon, P. G.; Ward, M. J.; Heikkila, M. J.; Monillas, W. H.; Yap, G. P. A.; Ritala, M.; Leskelä, M. Chemical Vapour Deposition of In2O3 Thin Films from a Tris-Guanidinate Indium Precursor. Dalt. Trans. 2011, 40, 9425– 9430, DOI: 10.1039/c1dt10877h24Chemical vapour deposition of In2O3 thin films from a tris-guanidinate indium precursorBarry, Sean T.; Gordon, Peter G.; Ward, Matthew J.; Heikkila, Mikko J.; Monillas, Wesley H.; Yap, Glenn P. A.; Ritala, Mikko; Leskelae, MarkkuDalton Transactions (2011), 40 (37), 9425-9430CODEN: DTARAF; ISSN:1477-9226. (Royal Society of Chemistry)A new homoleptic sublimable indium(III) guanidinate, (In[(NiPr)2CNMe2]3) (I), was synthesized from a facile high-yield procedure. Compd. I crystd. is a P‾1 space group; a = 10.5989(14) Å, b = 11.0030(15) Å, c = 16.273(2) Å, α = 91.190(2)°, β = 96.561(2)°, γ = 115.555(2)°; R = 3.50%. Thermogravimetric anal. showed I to produce elemental indium as a residual mass. Thermolysis in a sealed NMR tube showed carbodiimide and protonated dimethylamine by 1H NMR. Chem. vapor deposition expts. at > 275°C with air as the reactant gas showed I to readily deposit cubic indium oxide with good transparency.
- 25Brazeau, A. L.; DiLabio, G. A.; Kreisel, K. A.; Monillas, W.; Yap, G. P. A.; Barry, S. T. Theoretical and Experimental Investigations of Ligand Exchange in Guanidinate Ligand Systems for Group 13 Metals. J. Chem. Soc. Dalt. Trans. 2007, (30), 3297– 3304, DOI: 10.1039/b706044kThere is no corresponding record for this reference.
- 26Kenney, A. P.; Yap, G. P. A.; Richeson, D. S.; Barry, S. T. The Insertion of Carbodiimides into Al and Ga Amido Linkages. Guanidinates and Mixed Amido Guanidinates of Aluminum and Gallium. Inorg. Chem. 2005, 44, 2926– 2933, DOI: 10.1021/ic048433g26The Insertion of Carbodiimides into Al and Ga Amido Linkages. Guanidinates and Mixed Amido Guanidinates of Aluminum and GalliumKenney, Amanda P.; Yap, Glenn P. A.; Richeson, Darrin S.; Barry, Sean T.Inorganic Chemistry (2005), 44 (8), 2926-2933CODEN: INOCAJ; ISSN:0020-1669. (American Chemical Society)The insertion of carbodiimides into existing metal-heteroatom bonds is an important preparative route for the synthesis of useful ligand systems such as amidinates and guanidinates. The authors' interest lies in multiple insertions at one metal center and the mechanisms of insertion and rearrangement. The authors synthesized and characterized [Me2NC(NiPr)2]nM(NMe2)3-n (n = 1, 2, 3; M = Al, Ga). The authors have studied the mechanism of synthesis and discovered a ligand transfer step that is important for the formation of the final products.
- 27Brazeau, A. L.; Wang, Z.; Rowley, C. N.; Barry, S. T. Synthesis and Thermolysis of Aluminum Amidinates: A Ligand-Exchange Route for New Mixed-Ligand Systems. Inorg. Chem. 2006, 45, 2276– 2281, DOI: 10.1021/ic051856d27Synthesis and Thermolysis of Aluminum Amidinates: A Ligand-Exchange Route for New Mixed-Ligand SystemsBrazeau, Allison L.; Wang, Zhaohui; Rowley, Chris N.; Barry, Sean T.Inorganic Chemistry (2006), 45 (5), 2276-2281CODEN: INOCAJ; ISSN:0020-1669. (American Chemical Society)A novel ligand-exchange route for the synthesis of amidinate-contg. compds. of aluminum is explored. Aluminum amidinates RC(NiPr)2AlR12 (4, 5; R = Me, R1 = Et; R = Et, R1 = Me) were prepd. starting from the corresponding carbodiimides, RLi and R12AlCl; guanidinate [Me2NC(NiPr)2]2AlH (6) was prepd. by redistribution reaction of the tris-guanidinate with AlH3·NMe2Et. The thermal reactivities of these compds. and their parent homoleptic compds. [MeC(NiPr)2]3Al (1), [Me2NC(NiPr)2]3Al (2), and [EtC(NiPr)2]3Al (3) were explored and analyzed with respect to their utility as potential at.-layer-deposition precursors for aluminum-contg. films. The major mechanism of thermal decompn. is found to be carbodiimide deinsertion to form aluminum alkyls or amides. Because of their thermal characteristics, both compds. 3 and 5 hold promise for use as precursors.
- 28Leman, J. T.; Barron, A. R. Synthesis of 1,3-Diphenyltriazenide Complexes of Aluminium, Gallium and Indium: Crystal Structure of Tris(1,3-Diphenyltriazenido)Aluminium(III). Polyhedron 1989, 8, 1909– 1912, DOI: 10.1016/S0277-5387(00)86413-X29Synthesis of 1,3-diphenyltriazenide complexes of aluminum, gallium and indium: crystal structure of tris(1,3-diphenyltriazenido)aluminum(III)Leman, John T.; Barron, Andrew R.; Ziller, Joseph W.; Kren, Robert M.Polyhedron (1989), 8 (15), 1909-12CODEN: PLYHDE; ISSN:0277-5387.The reaction of AlMe3 with 1,3-diphenyltriazene [Hdpt] in toluene gave Al(dpt)3, even when AlMe3 was in large excess. Monomeric Al(dpt)3 crystd. in space group C2/c with a 20.587(3), b 16.005(3), c 13.236(3) Å and β 119.172(12)°, Z 4, R 0.067 and Rw 0.083. The Al(III) is coordinated by 3 chelating triazenido ligands to give a trigonally distorted octahedral geometry. The Ga and In analogs are also reported.
- 29Leman, J. T.; Braddock-Wilking, J.; Coolong, A. J.; Barron, A. R. 1,3-Diaryltriazenido Compounds of Aluminum. Inorg. Chem. 1993, 32, 4324– 4336, DOI: 10.1021/ic00072a028301,3-Diaryltriazenido compounds of aluminumLeman, John T.; Braddock-Wilking, Janet; Coolong, Alanna J.; Barron, Andrew R.Inorganic Chemistry (1993), 32 (20), 4324-36CODEN: INOCAJ; ISSN:0020-1669.Reaction of AlH(iBu)2 with 1 and 2 equiv of 1,3-diphenyltriazene, PhN:NNHPh, yields [cyclic] Al(iBu)2[N(Ph)NN(Ph)] (1) and [cyclic] Al(iBu)[N(Ph)NN(Ph)]2 (2), resp. Compd. 2 undergoes ligand exchange in soln. to give an equimolar mixt. of 1 and [cyclic] Al[N(Ph)NN(Ph)]3. The reaction of Al(tBu)3 with PhN:NNHPh gives [cyclic] Al(tBu)2[N(Ph)NN(Ph)] (3) as the only product. Addn. of 1 equiv of PhN:NNHPh to AlMe2(BHT)(OEt2) (BHT-H = 2,6-di-tert-butyl-4-methylphenol) allows for the isolation of [cyclic] AlMe(BHT)[N(Ph)NN(Ph)] (4); however, a higher equiv of PhN:NNHPh yields only [cyclic] Al[N(Ph)NN(Ph)]3. The bis(triazenide) complex [cyclic] Al(BHT)[N(Ph)NN(Ph)]2 (5) is isolated from the reaction of PhN:NNHPh with AlH2(BHT)(NMe3), while [cyclic] Al(BHT)2[N(Ph)NN(Ph)] (6) is formed from the reaction of PhN:NNHPh with AlMe(BHT)2. Although the reaction of 1 with H2salen [N,N'-ethylenebis(salicylideneamine)] does not yield [cyclic] Al[N(Ph)NN(Ph)](salen) (8) but rather yields Al(iBu)(salen) (7), compd. 8 may be isolated from interaction of PhN:NNHPh with AlMe(salen). The reaction between AlMe3 and 3 equiv of substituted 1,3-diaryltriazenes, ArN:NNHAr, yields the 6-coordinate aluminum tris(1,3-diaryltriazenido) compds., [cyclic] Al[N(Ar)NN(Ar)]3 [Ar = 2-MeC6H4 (9), 4-MeC6H4 (10), 4-MeOC6H4 (11), 4-FC6H4 (12), 4-ClC6H4 (13), 4-BrC6H4 (14), C6F5 (15)]. The unsym. diaryltriazene complex [cyclic] Al[N(Ph)NN(4-MeOC6H4)]3 (16) adopts a trans-meridional conformation. The spectroscopic characterization of the tris(triazenido) complexes is discussed with respect to the nature of the aryl substituents. The X-ray structures of 1, 6, AlMe(salen), 9, 11, 13, (C6F5)N:NN(H)(C6F5), and (2-MeC6H4)N:NN(H)(2-MeC6H4).(2-MeC6H4)NH2 have been detd.
- 30O’Brien, N. J.; Rouf, P.; Samii, R.; Rönnby, K.; Buttera, S. C.; Hsu, C.-W.; Ivanov, I. G.; Kessler, V.; Ojamäe, L.; Pedersen, H. In-Situ Activation of an Indium(III) Triazenide Precursor for Epitaxial Indium Nitride by Atomic Layer Deposition. Chem. Mater. 2020, 32, 4481– 4489, DOI: 10.1021/acs.chemmater.9b0517131In Situ Activation of an Indium(III) Triazenide Precursor for Epitaxial Growth of Indium Nitride by Atomic Layer DepositionO'Brien, Nathan J.; Rouf, Polla; Samii, Rouzbeh; Roennby, Karl; Buttera, Sydney C.; Hsu, Chih-Wei; Ivanov, Ivan G.; Kessler, Vadim; Ojamaee, Lars; Pedersen, HenrikChemistry of Materials (2020), 32 (11), 4481-4489CODEN: CMATEX; ISSN:0897-4756. (American Chemical Society)Indium nitride (InN) is characterized by its high electron mobility, making it a ground-breaking material for high frequency electronics. The difficulty of depositing high-quality cryst. InN currently impedes its broad implementation in electronic devices. A new highly volatile In(III) triazenide precursor is reported, and its ability to deposit high-quality epitaxial hexagonal InN by at. layer deposition (ALD) is demonstrated. The new In(III) precursor, the 1st example of a homoleptic triazenide used in a vapor deposition process, was easily synthesized and purified by sublimation. TGA showed single step volatilization with an onset temp. of 145° and negligible residual mass. Two temp. intervals with self-limiting growth were obsd. when depositing InN films. In the high-temp. interval, the precursor underwent a gas-phase thermal decompn. inside the ALD reaction chamber to produce a more reactive In(III) compd. while retaining self-limiting growth behavior. D. functional theory calcns. revealed a unique 2-step decompn. process, which liberates 3 mols. of each propene and N2 to give a smaller tricoordinated In(III) species. Stoichiometric InN films with low levels of impurities were grown epitaxially on 4H-SiC. The InN films deposited at 325° had a sheet resistivity of 920 Ω/sq. This new triazenide precursor enables ALD of InN for semiconductor applications and provides a new family of M-N bonded precursors for future deposition processes. Crystallog. data are given.
- 31Rouf, P.; Samii, R.; Rönnby, K.; Bakhit, B.; Buttera, S. C.; Martinovic, I.; Ojamäe, L.; Hsu, C.-W.; Palisaitis, J.; Kessler, V.; Pedersen, H.; O’Brien, N. J. Hexacoordinated Gallium(III) Triazenide Precursor for Epitaxial Gallium Nitride by Atomic Layer Deposition. ChemRxiv 2020, DOI: 10.26434/chemrxiv.13190636.v1 .There is no corresponding record for this reference.
- 32Bottaro, J. C.; Penwell, P. E.; Schmitt, R. J. Expedient Synthesis of T-Butyl Azide. Synth. Commun. 1997, 27, 1465– 1467, DOI: 10.1080/0039791970800607833Expedient synthesis of tert-butyl azideBottaro, Jeffrey C.; Penwell, Paul E.; Schmitt, Robert J.Synthetic Communications (1997), 27 (8), 1465-1467CODEN: SYNCAV; ISSN:0039-7911. (Dekker)A simple, economical synthesis of bulk (1-10,000 mol) amts. of Me3CN3 is described, using only Me3COH, H2O, NaN3 and H2SO4.
- 33Swetha, M.; Ramana, P. V.; Shirodkar, S. G. Simple and Efficient Method for the Synthesis of Azides in Water-THF Solvent System. Org. Prep. Proced. Int. 2011, 43, 348– 353, DOI: 10.1080/00304948.2011.59400234Simple and efficient method for the synthesis of azides in water-THF solvent systemSwetha, M.; Ramana, P. Venkata; Shirodkar, S. G.Organic Preparations and Procedures International (2011), 43 (4), 348-353CODEN: OPPIAK; ISSN:0030-4948. (Taylor & Francis Ltd.)The synthesis of azides under mild reaction conditions using a simple work-up was reported. Treatment of alkyl halides, mesylates, triflates, acetates, and tosylates with NaN3 in water-THF (95:5) at reflux yielded the corresponding alkyl azides. Addnl., arom. and aliph. acid chlorides were converted into acyl azides.
- 34Mayo, D. H.; Peng, Y.; Zavalij, P.; Bowen, K. H.; Eichhorn, B. W. Aluminium(III) Amidinates Formed from Reactions of “AlCl” with Lithium Amidinates. Acta Crystallogr., Sect. C: Cryst. Struct. Commun. 2013, 69, 1120– 1123, DOI: 10.1107/S010827011302313535Aluminium(III) amidinates formed from reactions of AlCl with lithium amidinatesMayo, Dennis H.; Peng, Yang; Zavalij, Peter; Bowen, Kit H.; Eichhorn, Bryan W.Acta Crystallographica, Section C: Crystal Structure Communications (2013), 69 (10), 1120-1123CODEN: ACSCEE; ISSN:0108-2701. (International Union of Crystallography)The disproportionation of AlCl(THF)n (THF is tetrahydrofuran) in the presence of lithium amidinate species gives aluminum(III) amidinate complexes with partial or full chloride substitution. Three aluminum amidinate complexes formed during the reaction between aluminum monochloride and lithium amidinates are presented. The homoleptic complex tris(N,N'-diisopropylbenzimidamido)aluminum(III), [Al(C13H19N2)3] or Al{PhC[N(i-Pr)]2}3, (I), crystallizes from the same soln. as the heteroleptic complex chloridobis(N,N'-diisopropylbenzimidamido)aluminum(III), [Al(C13H19N2)2Cl] or Al{PhC[N(i-Pr)]2}2Cl, (II). Both have two crystallog. independent mols. per asym. unit (Z' = 2) and (I) shows disorder in four of its N(i-Pr) groups. Changing the ligand substituent to the bulkier cyclohexyl allows the isolation of the partial THF solvate chloridobis(N,N'-dicyclohexylbenzimidamido)aluminum(III) THF 0.675-solvate, [Al(C19H27N2)2Cl]·0.675C4H8O or Al[PhC(NCy)2]2Cl·0.675THF, (III). Despite having a twofold rotation axis running through its Al and Cl atoms, (III) has a similar mol. structure to that of (II).
- 35Springer Jr, C. S.; Sievers, R. E. Intramolecular Isomerization of Octahedral Complexes by Mechanisms Not Involving Bond Rupture. Inorg. Chem. 1967, 6, 852– 854, DOI: 10.1021/ic50050a049There is no corresponding record for this reference.
- 36Rodger, A.; Johnson, B. F. Which Is More Likely: The Ray-Dutt Twist or the Bailar Twist?. Inorg. Chem. 1988, 27, 3061– 3062, DOI: 10.1021/ic00291a00137Which is more likely: the Ray-Dutt twist or the Bailar twist?Rodger, Alison; Johnson, Brian F. G.Inorganic Chemistry (1988), 27 (18), 3061-2CODEN: INOCAJ; ISSN:0020-1669.A recently developed model for detg. the relative stabilities of MLn systems is applied to the transition states of the non-bond breaking rearrangement mechanisms of tris chelate metal complexes. It is concluded that a complex with chelate bite much smaller than the distance between ligating atoms in the reactant proceeds via a Bailar twist mechanism, and that the Ray Dutt twist is favored under the opposite circumstances.
- 37Bryant, R. G. The NMR Time Scale. J. Chem. Educ. 1983, 60, 933– 935, DOI: 10.1021/ed060p93338The NMR time scaleBryant, Robert G.Journal of Chemical Education (1983), 60 (11), 933-5CODEN: JCEDA8; ISSN:0021-9584.Ambiguity in the NMR time-scale is discussed which can be extd. from different aspects of the spectrum. These include the relaxation rates assocd. with the lines, scalar coupling patterns, and resonance frequencies or chem. shifts.
- 38Kunte, G. V.; Shivashankar, S. A.; Umarji, A. M. Thermogravimetric Evaluation of the Suitability of Precursors for MOCVD. Meas. Sci. Technol. 2008, 19, 025704, DOI: 10.1088/0957-0233/19/2/02570439Thermogravimetric evaluation of the suitability of precursors for MOCVDKunte, G. V.; Shivashankar, S. A.; Umarji, A. M.Measurement Science and Technology (2008), 19 (2), 025704/1-025704/7CODEN: MSTCEP; ISSN:0957-0233. (Institute of Physics Publishing)A method based on the Langmuir equation for the estn. of vapor pressure and enthalpy of sublimation of subliming compds. is described. The variable temp. thermogravimetric/differential thermogravimetric (TG/DTG) curve of benzoic acid is used to arrive at the instrument parameters. Employing these parameters, the vapor pressure-temp. curves are derived for salicylic acid and camphor from their TG/DTG curves. The values match well with vapor pressure data in the literature, obtained by effusion methods. By employing the Clausius-Clapeyron equation, the enthalpy of sublimation could be calcd. Extending the method further, two precursors for metal-org. chem. vapor deposition (MOCVD) of titanium oxide, bis-iso-Pr bis tert-Bu 2-oxobutanoato titanium, Ti(OiPr)2(tbob)2, and bis-oxo-bis-tert-Bu 2-oxobutanoato titanium, [TiO(tbob)2]2, have been evaluated. The complex Ti(OiPr)2(tbob)2 is found to be a more suitable precursor. This approach can be helpful in quickly screening for the suitability of a compd. as a CVD precursor.
- 39Colominas, C.; Lau, K. H.; Hildenbrand, D. L.; Crouch-Baker, S.; Sanjurjo, A. Vapor Pressures of the Copper and Yttrium β-Diketonate MOCVD Precursors. J. Chem. Eng. Data 2001, 46, 446– 450, DOI: 10.1021/je000344540Vapor Pressures of the Copper and Yttrium β-Diketonate MOCVD PrecursorsColominas, Carles; Lau, Kai H.; Hildenbrand, Donald L.; Crouch-Baker, Steven; Sanjurjo, AngelJournal of Chemical and Engineering Data (2001), 46 (2), 446-450CODEN: JCEAAX; ISSN:0021-9568. (American Chemical Society)The vapor pressures and vapor mol. wts. of the copper and yttrium β-diketonate MOCVD precursors Cu(C11H19O2)2(c) and Y(C11H19O2)3(c) were measured by a torsion-effusion/mass-loss method in the ranges (346 to 375) K and (361 to 387) K, resp. The mol. wt. data indicate that the satd. vapors of both precursors are highly monomeric. Vapor pressures, estd. to be accurate within 5%, are presented in equation form for reliable extrapolation to higher temps. The results are compared with other detns. in the literature.
- 40Frisch, M. J.; Trucks, G. W.; Schlegel, H. B.; Scuseria, G. E.; Robb, M. A.; Cheeseman, J. R.; Scalmani, G.; Barone, V.; Petersson, G. A.; Nakatsuji, H.; Li, X.; Caricato, M.; Marenich, A. V.; Bloino, J.; Janesko, B. G.; Gomperts, R.; Mennucci, B.; Hratchian, H. P.; Ortiz, J. V.; Izmaylov, A. F.; Sonnenberg, J. L.; Williams-Young, D.; Ding, F.; Lipparini, F.; Egidi, F.; Goings, J.; Peng, B.; Petrone, A.; Henderson, T.; Ranasinghe, D.; Zakrzewski, V. G.; Gao, J.; Rega, N.; Zheng, G.; Liang, W.; Hada, M.; Ehara, M.; Toyota, K.; Fukuda, R.; Hasegawa, J.; Ishida, M.; Nakajima, T.; Honda, Y.; Kitao, O.; Nakai, H.; Vreven, T.; Throssell, K.; Montgomery, J. A., Jr.; Peralta, J. E.; Ogliaro, F.; Bearpark, M.; Heyd, J. J.; Brothers, E. N.; Kudin, K. N.; Staroverov, V. N.; Kobayashi, R.; Normand, J.; Raghavachari, K.; Rendell, A.; Burant, J. C.; Iyengar, S. S.; Tomasi, J.; Cossi, M.; Millam, J. M.; Klene, M.; Adamo, C.; Cammi, R.; Ochterski, J. W.; Martin, R. L.; Morokuma, K.; Farkas, O.; Foresman, J. B.; Fox, D. J. Gaussian 16, revision B.01; Gaussian, Inc.: Wallingford CT, 2016.There is no corresponding record for this reference.
- 41Hanson-Heine, M. W. D.; George, M. W.; Besley, N. A. Calculating Excited State Properties Using Kohn-Sham Density Functional Theory. J. Chem. Phys. 2013, 138, 064101, DOI: 10.1063/1.478981342Calculating excited state properties using Kohn-Sham density functional theoryHanson-Heine, Magnus W. D.; George, Michael W.; Besley, Nicholas A.Journal of Chemical Physics (2013), 138 (6), 064101/1-064101/8CODEN: JCPSA6; ISSN:0021-9606. (American Institute of Physics)The accuracy of excited states calcd. with Kohn-Sham d. functional theory using the max. overlap method has been assessed for the calcn. of adiabatic excitation energies, excited state structures, and excited state harmonic and anharmonic vibrational frequencies for open-shell singlet excited states. The computed Kohn-Sham adiabatic excitation energies are improved significantly by post SCF spin-purifn., but remain too low compared with expt. with a larger error than time-dependent d. functional theory. Excited state structures and vibrational frequencies are also improved by spin-purifn. The structures show a comparable accuracy to time-dependent d. functional theory, while the harmonic vibrational frequencies are found to be more accurate for the majority of vibrational modes. The computed harmonic vibrational frequencies are also further improved by perturbative anharmonic corrections, suggesting a good description of the potential energy surface. Overall, excited state Kohn-Sham d. functional theory is shown to provide an efficient method for the calcn. of excited state structures and vibrational frequencies in open-shell singlet systems and provides a promising technique that can be applied to study large systems. (c) 2013 American Institute of Physics.
- 42Lecklider, T. Evaluation Engineering: Maintaining a Healthy Rhythm , 2011. https://www.evaluationengineering.com/home/article/13005576/maintaining-a-healthy-rhythm.There is no corresponding record for this reference.
- 43Grimme, S.; Antony, J.; Ehrlich, S.; Krieg, H. A Consistent and Accurate Ab Initio Parametrization of Density Functional Dispersion Correction (DFT-D) for the 94 Elements H-Pu. J. Chem. Phys. 2010, 132, 154104, DOI: 10.1063/1.338234444A consistent and accurate ab initio parametrization of density functional dispersion correction (DFT-D) for the 94 elements H-PuGrimme, Stefan; Antony, Jens; Ehrlich, Stephan; Krieg, HelgeJournal of Chemical Physics (2010), 132 (15), 154104/1-154104/19CODEN: JCPSA6; ISSN:0021-9606. (American Institute of Physics)The method of dispersion correction as an add-on to std. Kohn-Sham d. functional theory (DFT-D) has been refined regarding higher accuracy, broader range of applicability, and less empiricism. The main new ingredients are atom-pairwise specific dispersion coeffs. and cutoff radii that are both computed from first principles. The coeffs. for new eighth-order dispersion terms are computed using established recursion relations. System (geometry) dependent information is used for the first time in a DFT-D type approach by employing the new concept of fractional coordination nos. (CN). They are used to interpolate between dispersion coeffs. of atoms in different chem. environments. The method only requires adjustment of two global parameters for each d. functional, is asymptotically exact for a gas of weakly interacting neutral atoms, and easily allows the computation of at. forces. Three-body nonadditivity terms are considered. The method has been assessed on std. benchmark sets for inter- and intramol. noncovalent interactions with a particular emphasis on a consistent description of light and heavy element systems. The mean abs. deviations for the S22 benchmark set of noncovalent interactions for 11 std. d. functionals decrease by 15%-40% compared to the previous (already accurate) DFT-D version. Spectacular improvements are found for a tripeptide-folding model and all tested metallic systems. The rectification of the long-range behavior and the use of more accurate C6 coeffs. also lead to a much better description of large (infinite) systems as shown for graphene sheets and the adsorption of benzene on an Ag(111) surface. For graphene it is found that the inclusion of three-body terms substantially (by about 10%) weakens the interlayer binding. We propose the revised DFT-D method as a general tool for the computation of the dispersion energy in mols. and solids of any kind with DFT and related (low-cost) electronic structure methods for large systems. (c) 2010 American Institute of Physics.
- 44Weigend, F.; Ahlrichs, R. Balanced Basis Sets of Split Valence, Triple Zeta Valence and Quadruple Zeta Valence Quality for H to Rn: Design and Assessment of Accuracy. Phys. Chem. Chem. Phys. 2005, 7, 3297– 3305, DOI: 10.1039/b508541a45Balanced basis sets of split valence, triple zeta valence and quadruple zeta valence quality for H to Rn: Design and assessment of accuracyWeigend, Florian; Ahlrichs, ReinhartPhysical Chemistry Chemical Physics (2005), 7 (18), 3297-3305CODEN: PPCPFQ; ISSN:1463-9076. (Royal Society of Chemistry)Gaussian basis sets of quadruple zeta valence quality for Rb-Rn are presented, as well as bases of split valence and triple zeta valence quality for H-Rn. The latter were obtained by (partly) modifying bases developed previously. A large set of more than 300 mols. representing (nearly) all elements-except lanthanides-in their common oxidn. states was used to assess the quality of the bases all across the periodic table. Quantities investigated were atomization energies, dipole moments and structure parameters for Hartree-Fock, d. functional theory and correlated methods, for which we had chosen Moller-Plesset perturbation theory as an example. Finally recommendations are given which type of basis set is used best for a certain level of theory and a desired quality of results.
- 45Metz, B.; Stoll, H.; Dolg, M. Small-Core Multiconfiguration-Dirac-Hartree-Fock-Adjusted Pseudopotentials for Post-d Main Group Elements: Application to PhB and PbO. J. Chem. Phys. 2000, 113, 2563– 2569, DOI: 10.1063/1.130588046Small-core multiconfiguration-Dirac-Hartree-Fock-adjusted pseudopotentials for post-d main group elements: Application to PbH and PbOMetz, Bernhard; Stoll, Hermann; Dolg, MichaelJournal of Chemical Physics (2000), 113 (7), 2563-2569CODEN: JCPSA6; ISSN:0021-9606. (American Institute of Physics)Relativistic pseudopotentials (PPs) of the energy-consistent variety have been generated for the post-d group 13-15 elements, by adjustment to multiconfiguration Dirac-Hartree-Fock data based on the Dirac-Coulomb-Breit Hamiltonian. The outer-core (n-1)spd shells are explicitly treated together with the nsp valence shell, with these PPs, and the implications of the small-core choice are discussed by comparison to a corresponding large-core PP, in the case of Pb. Results from valence ab initio one- and two-component calcns. using both PPs are presented for the fine-structure splitting of the ns2np2 ground-state configuration of the Pb atom, and for spectroscopic consts. of PbH (X 2Π1/2, 2Π3/2) and PbO (X 1Σ+). In addn., a combination of small-core and large-core PPs has been explored in spin-free-state shifted calcns. for the above mols.
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Characterization of the compounds and computational calculation details (PDF)
Compound 1 (CIF)
Compound 6 (CIF)
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